Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US201337Application Date: 1988-05-27
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Publication No.: US4803308APublication Date: 1989-02-07
- Inventor: Toshimichi Taguchi
- Applicant: Toshimichi Taguchi
- Applicant Address: JPX Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JPX Osaka
- Priority: JPX61-24915[U] 19860221
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/34 ; H05K1/00
Abstract:
A printed circuit board has a copper foil pattern formed thereon in the shape of exclamation marks oriented in the direction of solder flow such that undesirable peelback effects can be isolated and the amount of solder attached to the pattern can be uniformly controlled.
Public/Granted literature
- US5449861A Wire for press-connecting terminal and method of producing the conductive wire Public/Granted day:1995-09-12
Information query
