A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.