发明授权
US4829663A Method of mounting surface-mounted type electronic components on a
printed circuit board
失效
将表面安装型电子部件安装在印刷电路板上的方法
- 专利标题: Method of mounting surface-mounted type electronic components on a printed circuit board
- 专利标题(中): 将表面安装型电子部件安装在印刷电路板上的方法
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申请号: US173076申请日: 1988-03-25
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公开(公告)号: US4829663A公开(公告)日: 1989-05-16
- 发明人: Sho Masujima , Hiroshi Yagi , Masakazu Kamoshida , Atsuzo Tamashima
- 申请人: Sho Masujima , Hiroshi Yagi , Masakazu Kamoshida , Atsuzo Tamashima
- 申请人地址: JPX Tokyo
- 专利权人: TDK Corporation
- 当前专利权人: TDK Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX62-71234 19870325
- 主分类号: B23P21/00
- IPC分类号: B23P21/00 ; H05K3/30 ; H05K13/00 ; H05K13/02 ; H05K13/04
摘要:
A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.
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