公开(公告)号：US5089314A

公开(公告)日：1992-02-18

申请号：US481756

申请日：1990-02-15

申请人： Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Masakazu Kamoshida

发明人： Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Masakazu Kamoshida

IPC分类号： B65G35/04 ,  H05K3/30 ,  H05K13/00

CPC分类号： H05K13/003 ,  B65G35/04 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/83191 ,  H05K3/303 ,  Y10S428/901 ,  Y10S428/908 ,  Y10T428/24479 ,  Y10T428/24826 ,  Y10T428/24917

摘要： A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series. When respective electronic circuit elements are removed from the electronic circuit element series, the adhesive means sticking to the respective electronic circuit elements are adapted to be also removed from the series. The adhesive means sticking to the respective electronic circuit elements are then heated, through which adhesive means have exhibited adhesion due to heating the respective electronic circuit elements are provisionally held on a printed circuit board. Also, a method of manufacturing an electronic circuit element series is disclosed.

摘要翻译： 用于电子电路元件的载带适于在通过焊接将它们固定在所述印刷电路板上之前临时保持在印刷电路板上，包括沿纵向方向延伸的柔性带体和相对于带体施加的粘合装置 并且为了在印刷电路板上暂时保持电子电路元件的目的，粘合装置由在加热时显示粘附性的材料形成。 粘合装置由在加热时显示粘附性的聚合材料形成。 载带还包括通过粘合装置沿着带体的纵向方向以相等的间隔相对于带体保持的电子电路元件，从而构成电子电路元件系列。 当从电子电路元件系列移除各自的电子电路元件时，粘附到各个电子电路元件的粘合剂装置也可以从串联中移除。 然后，粘附到各个电子电路元件的粘合剂装置被加热，由于加热，粘合剂装置已经表现出粘附，各个电子电路元件临时保持在印刷电路板上。 此外，公开了一种制造电子电路元件系列的方法。

公开(公告)号：US4829663A

公开(公告)日：1989-05-16

申请号：US173076

申请日：1988-03-25

申请人： Sho Masujima ,  Hiroshi Yagi ,  Masakazu Kamoshida ,  Atsuzo Tamashima

发明人： Sho Masujima ,  Hiroshi Yagi ,  Masakazu Kamoshida ,  Atsuzo Tamashima

IPC分类号： B23P21/00 ,  H05K3/30 ,  H05K13/00 ,  H05K13/02 ,  H05K13/04

CPC分类号： H05K13/0408 ,  H05K13/003 ,  H05K3/305 ,  H01L2224/83385 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0537 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

摘要： A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.

摘要翻译： 一种将表面安装型电子部件安装在适于使用电子部件系列执行的印刷电路板的方法，所述电子部件系列包括形成有多个微小凹部的载带，用于在其中容纳用于临时固定表面安装型电子部件的粘合剂， 印刷电路板上的安装型电子部件，容纳在各个凹部中的粘合剂，以及通过粘合剂保持在载带上的多个表面安装型电子部件。 在本发明中，在将载带的微细凹部向上推的同时，使载带的电子部件卷绕，使得相同部分发生变形，能够容易地将电子部件与 然后将移除的电子部件放置在印刷电路板上，通过粘附在电子部件的底面上的粘合剂将其暂时保持在印刷电路板上。

公开(公告)号：US4873397A

公开(公告)日：1989-10-10

申请号：US138237

申请日：1987-12-28

申请人： Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Jun Tamashima

发明人： Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Jun Tamashima

IPC分类号： H05K3/30 ,  H05K3/34

CPC分类号： H05K3/305 ,  H05K3/306 ,  H05K2201/0125 ,  H05K2201/0162 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10984 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/306 ,  H05K3/301 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit element capable of positively and stably accomplishing its provisional fixing on a printed circuit board substantially free of any trouble and being readily taken out or extracted for the mounting on a printed circuit board, irrespective of a manner of holding of the circuit element prior to the extraction. The electronic circuit element includes an element body and an adhesive or polymeric layer deposited on the element body. The polymeric layer is arranged on a surface of the element body opposite to a printed circuit board on which the circuit element is to be mounted. The polymeric layer is formed of a material exhibiting adhesion when it is heated to a temperature of about 80.degree. C.

摘要翻译： 一种电子电路元件，其能够在印刷电路板上基本上没有任何故障并且容易地取出或提取以便安装在印刷电路板上，而不管电路元件的保持方式如何 提取。 电子电路元件包括元件主体和沉积在元件主体上的粘合剂或聚合物层。 聚合物层布置在元件主体的与要安装电路元件的印刷电路板相对的表面上。 聚合物层由在加热至约80℃的温度下显示出粘合性的材料形成。

公开(公告)号：US4834794A

公开(公告)日：1989-05-30

申请号：US130752

申请日：1987-12-09

申请人： Hiroshi Yagi ,  Atsuzo Tamashima

发明人： Hiroshi Yagi ,  Atsuzo Tamashima

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  B23K35/34 ,  H05K3/34

CPC分类号： H05K3/3484 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/264 ,  B23K35/266 ,  H05K2201/0272 ,  H05K3/3463

摘要： A solder composition having a low melting point and a high remelting point sufficient to permit electronic circuit elements to be fixed on a printed circuit board at a low soldering temperature to prevent thermal damage of the electronic circuit elements during the mounting and prevent the elements from dropping off from the board due to any heat applied thereto after soldering. The solder composition includes a low melting solder powder containing a metal additive for melting-point depression, and a reactive alloy powder. The low melting solder powder is melted to form a soldering layer which serves to mount electronic circuit elements on a printed circuit board at a relatively low soldering temperature. At the soldering temperature, the metal additive is reacted with the reactive alloy powder to cause the soldering layer to have a remelting temperature higher than a melting point of the solder composition or solder powder.

摘要翻译： 具有低熔点和高重熔点的焊料组合物，其足以允许电子电路元件以低焊接温度固定在印刷电路板上，以防止在安装期间电子电路元件的热损伤并防止元件掉落 由于在焊接后施加于其上的任何热量而从板上脱落。 焊料组合物包括含有用于熔点降低的金属添加剂的低熔点焊料粉末和反应性合金粉末。 将低熔点焊料粉末熔化以形成焊接层，其用于在相对低的焊接温度下将电子电路元件安装在印刷电路板上。 在焊接温度下，金属添加剂与反应性合金粉末反应，导致焊接层的熔融温度高于焊料组合物或焊料粉末的熔点。

公开(公告)号：US08902290B2

公开(公告)日：2014-12-02

申请号：US13351799

申请日：2012-01-17

申请人： Hiroshi Yagi ,  Toshiaki Yamada

发明人： Hiroshi Yagi ,  Toshiaki Yamada

IPC分类号： H04N13/00

CPC分类号： H04N13/156

摘要： The data processing unit generates image data such that the camera unit is caused to acquire a plurality of data captured with a focal length changed in response to instructions for imaging operation by an operation unit and three-dimensional display data are generated from the plurality of captured data based on the correlation of focused images which are different according to the focal lengths of the acquired plurality of captured data with the focal length thereof. Since each of the plurality of data captured with a focal length changed is different in a focused image according to the focal length, the plurality of captured data is subjected to the processing for generating three-dimensional display data based on the correlation of a focused image different according to the focal length with the focal length to allow the three-dimensional display data to be generated.

摘要翻译： 数据处理单元生成图像数据，使得摄像机单元被采集获得响应于由操作单元进行的成像操作的指令而改变的焦距所捕获的多个数据，并且从多个捕捉到的多个捕捉到的三维显示数据生成三维显示数据 基于根据所获取的多个捕获数据的焦距与其焦距不同的聚焦图像的相关性的数据。 由于根据焦距在聚焦图像中所改变的多个被拍摄的多个数据中的每一个都是不同的，所以根据聚焦图像的相关性对多个捕获数据进行用于产生三维显示数据的处理 根据具有焦距的焦距不同，以允许生成三维显示数据。

公开(公告)号：US08708932B2

公开(公告)日：2014-04-29

申请号：US13617439

申请日：2012-09-14

申请人： Noriyuki Tamai ,  Katsuhiro Shirakawa ,  Hiroshi Yagi

发明人： Noriyuki Tamai ,  Katsuhiro Shirakawa ,  Hiroshi Yagi

IPC分类号： A61B5/00

CPC分类号： A61M25/09 ,  A61M25/0041 ,  A61M2025/09133 ,  A61M2025/0915 ,  A61M2025/09175

摘要： The guide wire is a guide wire includes a distal portion and a main body portion. This guide wire is provided with a first curve portion; a second curve portion included on the distal side of aforesaid first curve portion and curved to the opposite direction with respect to aforesaid first curve portion; a third curve portion included on the distal side of aforesaid second curve portion and curved to the opposite direction with respect to aforesaid second curve portion, wherein a line contacting with both aforesaid first curve portion and aforesaid third curve portion has an obtuse angle with respect to an axis line of aforesaid main body portion.

摘要翻译： 导丝是包括远侧部分和主体部分的导丝。 该引导线设置有第一曲线部分; 第二曲线部分包括在上述第一曲线部分的远侧上并相对于上述第一曲线部分弯曲到相反方向; 第三曲线部分包括在上述第二曲线部分的远侧上并相对于上述第二曲线部分弯曲到相反方向，其中与上述第一曲线部分和上述第三曲线部分两者接触的线相对于 上述主体部分的轴线。

公开(公告)号：US20130323708A1

公开(公告)日：2013-12-05

申请号：US13392661

申请日：2010-06-30

申请人： Martin Yarmush ,  Basak E. Uygun ,  Mustafa Korkut Uygun ,  Maria Louisa Izamis ,  Alejandro Soto-Gutierrez ,  Herman Tolboom ,  Hiroshi Yagi ,  Carley Shulman ,  John Miles Milwid

发明人： Martin Yarmush ,  Basak E. Uygun ,  Mustafa Korkut Uygun ,  Maria Louisa Izamis ,  Alejandro Soto-Gutierrez ,  Herman Tolboom ,  Hiroshi Yagi ,  Carley Shulman ,  John Miles Milwid

IPC分类号： C12N5/071

CPC分类号： C12N5/067 ,  A01N1/021 ,  A01N1/0247 ,  A61K35/407 ,  A61M1/14

摘要： One aspect of the invention provides a method for harvesting adult cells from an organ. The method includes perfusing the organ with a perfusate and isolating adult cells from the organ, thereby harvesting the adult cells from the organ. Another aspect of the invention provides a method for rehabilitating an organ. The method includes: dividing the organ into a first portion and a second portion, perfusing the first portion with a decellularization medium, isolating adult cells from the second portion, and recellularizing the first portion with a suspension of the adult cells, thereby rehabilitating the organ.

公开(公告)号：US20130211382A1

公开(公告)日：2013-08-15

申请号：US13763423

申请日：2013-02-08

申请人： Takayuki Mouri ,  Hiroshi Yagi

发明人： Takayuki Mouri ,  Hiroshi Yagi

IPC分类号： A61M25/01

CPC分类号： A61M25/0133 ,  A61M25/01 ,  A61M25/02 ,  A61M2025/024

摘要： In one form, a direction changing device is provided including: a first mounting section; and a second mounting section, wherein an axial direction of the first mounting section and an axial direction of the second mounting section intersect each other or are parallel to each other in plan view, and in a condition where a catheter or a sheath introducer in which the catheter is inserted is mounted to the first mounting section and the second mounting section, the catheter or the sheath introducer adopts a curved shape such that a catheter or sheath introducer portion mounted to the first mounting section extends proximally to distally in one direction and a catheter or sheath introducer portion mounted to the second mounting section extends proximally to distally in another direction with the directions being different from each other.

摘要翻译： 在一种形式中，提供了一种方向改变装置，包括：第一安装部; 以及第二安装部，其中，所述第一安装部的轴向方向和所述第二安装部的轴向在平面图中彼此相交或彼此平行，并且在导管或护套导入器的状态下， 插入的导管被安装到第一安装部分和第二安装部分上，导管或护套引入器采用弯曲形状，使得安装到第一安装部分的导管或护套导引器部分沿一个方向向远侧延伸，并且 安装到第二安装部分的导管或鞘引入器部分沿着彼此不同的方向在另一方向上向远侧延伸。

公开(公告)号：US08123825B2

公开(公告)日：2012-02-28

申请号：US12844661

申请日：2010-07-27

申请人： Hiroshi Yagi ,  Takeshi Kihara ,  Koichi Suzuki

发明人： Hiroshi Yagi ,  Takeshi Kihara ,  Koichi Suzuki

IPC分类号： B01J7/00 ,  H01M8/06 ,  C01B3/36 ,  C01B6/24 ,  C01B3/02 ,  C10J3/46

CPC分类号： C01B3/583 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00835 ,  B01J2219/00873 ,  C01B3/323 ,  C01B2203/044 ,  C01B2203/047 ,  H01M8/0612 ,  Y02P70/56 ,  Y10T29/49982

摘要： A microreactor is configured to have a metal substrate having a microchannel portion on one surface thereof, a heater provided on the other surface of the metal substrate via an insulating film, a catalyst supported on the microchannel portion, and a cover member having a feed material inlet and a gas outlet and joined to the metal substrate so as to cover the microchannel portion. Since the microreactor uses the metal substrate having a high thermal conductivity and a small heat capacity, the efficiency of heat conduction from the heater to the supported catalyst becomes high, and the processing of the metal substrate is easy to facilitate the production.

摘要翻译： 微反应器被配置为具有在其一个表面上具有微通道部分的金属基板，经由绝缘膜设置在金属基板的另一表面上的加热器，支撑在微通道部分上的催化剂和具有进料的盖构件 入口和气体出口并连接到金属基底以覆盖微通道部分。 由于微反应器使用具有高导热性和小热容量的金属基板，因此从加热器到负载型催化剂的热传导效率变高，金属基板的加工容易制造。

公开(公告)号：US08079473B2

公开(公告)日：2011-12-20

申请号：US12510644

申请日：2009-07-28

申请人： Junko Matsuda ,  Hiroshi Yagi

发明人： Junko Matsuda ,  Hiroshi Yagi

IPC分类号： A61B17/06

CPC分类号： A61M25/002 ,  A61B50/20

摘要： A medical device holder is comprised of a flexible elongated sheet member, and includes a holding portion configured to hold a three-dimensionally configured part connected of the device. The holding portion is configured to bend back on itself to cover the three-dimensionally configured part. A slit is provided in the sheet member to allow insertion of the distal end portion of the holding portion so that the state in which the holding portion covers the three-dimensionally configured part connected can be maintained. The distal end portion of the holding portion is folded toward the opposite direction from the direction to pull out when retrieving the catheter from the sheet member.

摘要翻译： 医疗器械保持器由柔性细长片材构成，并且包括保持部，该保持部构造成保持与该器件连接的三维构造部。 保持部构造成自身弯曲以覆盖三维构造的部分。 在片状构件中设置有狭缝，以允许保持部的前端部的插入，从而可以保持保持部覆盖连接的三维构造部的状态。 当从片材构件收回导管时，保持部分的远端部分从朝向拉出方向的相反方向折叠。