发明授权
- 专利标题: Method of making a semiconductor memory device
- 专利标题(中): 制造半导体存储器件的方法
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申请号: US148956申请日: 1988-01-27
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公开(公告)号: US4830977A公开(公告)日: 1989-05-16
- 发明人: Hisao Katto , June Sugiura , Nozomi Horino , Akira Endo , Yoshiharu Takeuchi , Yuji Arakawa
- 申请人: Hisao Katto , June Sugiura , Nozomi Horino , Akira Endo , Yoshiharu Takeuchi , Yuji Arakawa
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX59-32444 19840224
- 主分类号: G11C11/401
- IPC分类号: G11C11/401 ; G11C5/02 ; H01L21/312 ; H01L21/3205 ; H01L21/768 ; H01L21/8242 ; H01L23/52 ; H01L23/522 ; H01L27/10 ; H01L27/108 ; H01L29/78
摘要:
A semiconductor memory device having wiring formed next to word lines at the extreme ends of the memory cell arrays or next to word lines of the dummy cell arrays, in order to prevent such word lines from breaking or from becoming deformed. The wiring is irrelevant to the circuit operation, but is provided with a fixed potential, and is formed through the steps of forming the word lines. The wiring makes the processing conditions applied to the neighboring word lines the same as the processing conditions applied to other word lines.
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