发明授权
- 专利标题: Printed circuit boards and method for manufacturing printed circuit boards
- 专利标题(中): 印刷电路板和制造印刷电路板的方法
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申请号: US203603申请日: 1988-06-02
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公开(公告)号: US4847446A公开(公告)日: 1989-07-11
- 发明人: David R. King , Mark S. Lee , Richard W. Decker
- 申请人: David R. King , Mark S. Lee , Richard W. Decker
- 申请人地址: PA Pittsburgh
- 专利权人: Westinghouse Electric Corp.
- 当前专利权人: Westinghouse Electric Corp.
- 当前专利权人地址: PA Pittsburgh
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K3/20 ; H05K3/24 ; H05K3/28 ; H05K3/40 ; H05K3/42 ; H05K3/46
摘要:
A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material. A second board panel is also fabricated, having a raised electrically conducting second circuit pattern extending from a its base layer of conductive material and a raised electrically conducting third circuit pattern extending from the second circuit pattern. The first board panel is laminated to the second board panel with a laminate insulating material disposed therebetween electrically insulating the first circuit pattern from the second circuit pattern and with the third circuit pattern electrically contacting the first circuit pattern at selected portions thereof. Finally, the base layers of conductive material are removed from the laminate insulating material.