公开(公告)号：US4912020A

公开(公告)日：1990-03-27

申请号：US240852

申请日：1988-09-02

申请人： David R. King ,  Mark S. Lee ,  Richard W. Decker

发明人： David R. King ,  Mark S. Lee ,  Richard W. Decker

IPC分类号： H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/205 ,  H05K1/112 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4652

摘要： A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the laminate insulating material (40).

摘要翻译： 描述了一种印刷电路板，其中电绝缘层压材料（40）具有第一和第二侧面。 导电第一电路图案（15）嵌入在层压材料（40）的第一侧中，并且导电的第二电路图案（20）嵌入在层压材料（40）的第二侧中，与第 第一电路图案（15）由层压材料（40）构成。 固体互连构件（20）延伸穿过层压材料（40）并且在其选定位置处电连接第一和第二电路图案（15,20）。 制造基板的方法包括作为第一步骤制造具有从导电材料的基底层（14）延伸的升高的导电第一电路图案（15）的第一板面板（10）和升高的导电的第二电路 图案（20）从第一电路图案（15）延伸。 还制造了第二板面板（30），其具有从导电材料的另一基底层（34）延伸的凸起的导电第三电路图案（35）。 第一板面板（10）用位于其间的层叠绝缘材料（40）层叠到第二板面板（30），使第一电路图案（15）与第三电路图案（35）电绝缘，并且第二电路图案 （20）在其选定部分与第一电路图案（15）电接触。 最后，将导电材料的基层（14,34）从叠层绝缘材料（40）中去除。

公开(公告)号：US4847446A

公开(公告)日：1989-07-11

申请号：US203603

申请日：1988-06-02

申请人： David R. King ,  Mark S. Lee ,  Richard W. Decker

发明人： David R. King ,  Mark S. Lee ,  Richard W. Decker

IPC分类号： H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4614 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4652

摘要： A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material. A second board panel is also fabricated, having a raised electrically conducting second circuit pattern extending from a its base layer of conductive material and a raised electrically conducting third circuit pattern extending from the second circuit pattern. The first board panel is laminated to the second board panel with a laminate insulating material disposed therebetween electrically insulating the first circuit pattern from the second circuit pattern and with the third circuit pattern electrically contacting the first circuit pattern at selected portions thereof. Finally, the base layers of conductive material are removed from the laminate insulating material.

摘要翻译： 描述了一种印刷电路板，其中电绝缘层压材料具有第一和第二侧面。 导电的第一电路图案嵌入在层压材料的第一侧中，并且导电的第二电路图案被层压材料与第一电​​路图案电绝缘的层压材料的第二侧嵌入。 固体互连构件延伸穿过层压材料，并且在其选定位置处电连接第一和第二电路图案。 制造该板的方法包括作为第一步骤制造具有从导电材料的基底层延伸的升高的导电第一电路图案的第一板面板。 还制造了第二板面板，其具有从其导电材料的基底层延伸的升高的导电的第二电路图案和从第二电路图案延伸的升高的导电的第三电路图案。 第一板面板被层压到第二板面板上，层叠绝缘材料设置在其间，将第一电路图案与第二电路图案电绝缘，并且第三电路图案在其选定部分与第一电路图案电接触。 最后，将导电材料的基层从叠层绝缘材料上除去。

公开(公告)号：US4769309A

公开(公告)日：1988-09-06

申请号：US921284

申请日：1986-10-21

申请人： David R. King ,  Mark S. Lee ,  Richard W. Decker

发明人： David R. King ,  Mark S. Lee ,  Richard W. Decker

IPC分类号： H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46 ,  G03C5/00

CPC分类号： H05K3/4647 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4614 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0152 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K3/243 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4652

摘要： A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material. A second board panel is also fabricated, having a raised electrically conducting second circuit pattern extending from a its base layer of conductive material and a raised electrically conducting third circuit pattern extending from the second circuit pattern. The first board panel is laminated to the second board panel with a laminate insulating material disposed therebetween electrically insulating the first circuit pattern from the second circuit pattern and with the third circuit pattern electrically contacting the first circuit pattern at selected portions thereof. Finally, the base layers of conductive material are removed from the laminate insulating material.

摘要翻译： 描述了一种印刷电路板，其中电绝缘层压材料具有第一和第二侧面。 导电的第一电路图案嵌入在层压材料的第一侧中，并且导电的第二电路图案被层压材料与第一电​​路图案电绝缘的层压材料的第二侧嵌入。 固体互连构件延伸穿过层压材料，并且在其选定位置处电连接第一和第二电路图案。 制造该板的方法包括作为第一步骤制造具有从导电材料的基底层延伸的升高的导电第一电路图案的第一板面板。 还制造了第二板面板，其具有从其导电材料的基底层延伸的升高的导电的第二电路图案和从第二电路图案延伸的升高的导电的第三电路图案。 第一板面板被层压到第二板面板上，层叠绝缘材料设置在其间，将第一电路图案与第二电路图案电绝缘，并且第三电路图案在其选定部分与第一电路图案电接触。 最后，将导电材料的基层从叠层绝缘材料上除去。