Invention Grant
- Patent Title: Signature opening apparatus
- Patent Title (中): 签名开启装置
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Application No.: US179887Application Date: 1988-04-11
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Publication No.: US4869484APublication Date: 1989-09-26
- Inventor: Ronald W. Hastie
- Applicant: Ronald W. Hastie
- Applicant Address: IL Chicago
- Assignee: R. R. Donnelley & Sons Company
- Current Assignee: R. R. Donnelley & Sons Company
- Current Assignee Address: IL Chicago
- Main IPC: B65H5/12
- IPC: B65H5/12 ; B65H5/30
Abstract:
A signature opening apparatus for receiving one signature at a time from a source of signatures fed to the apparatus in a steady stream. The apparatus includes an opening drum mounted for rotation on a shaft for delivering opened signatures to a continuous signature carrying chain. It utilizes at least one gripper assembly mounted for rotation with the opening drum for opening one signature at a time. The apparatus also includes a timing mechanism to allow the gripper assembly to initiate gripping of signatures at a first preselected point, to fully grip signatures at a second preselected point and to release signatures at a third preselected point. The gripper assembly includes an elongated countinuously curved finger having a first end mounted for rotation relative to the opening drum and a second end normally projecting beyond the opening drum. The apparatus also includes a seat as a part of the gripper assembly to be engaged by the second end of the finger. The gripper assembly is formed with the finger having a continuously curved inner surface and a continuously curved outer surface. It utilizes the timing mechanism to allow the finger to rotate from a position where the second end normally projects beyond the opening drum in spaced relation to the seat to a position where the second end cooperates with the seat to grip signatures therebetween. Additionally, the apparatus utilizes a mechanism for rotating the finger back to the position where the second end of the finger normally engages the seat.
Public/Granted literature
- US5886378A Single polysilicon layer flash E.sup.2 PROM cell Public/Granted day:1999-03-23
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