发明授权
- 专利标题： Process for interconnecting thin-film electrical circuits
- 专利标题（中）： 互连薄膜电路的工艺
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申请号： US263103申请日： 1988-10-26
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公开(公告)号： US4880959A公开(公告)日： 1989-11-14
- 发明人: Thomas H. Baum , Paul B. Comita , Robert L. Jackson
- 申请人： Thomas H. Baum , Paul B. Comita , Robert L. Jackson
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H05K3/40
- IPC分类号： H05K3/40 ; H01L21/70 ; H05K3/02 ; H05K3/22 ; H05K3/46
摘要：
Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed the pulsed laser.
公开/授权文献
- US4385411A Angle broom 公开/授权日：1983-05-31