发明授权
- 专利标题： Copper conductor composition
- 专利标题（中）： 铜导体组成
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申请号： US267592申请日： 1988-11-07
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公开(公告)号： US4906404A公开(公告)日： 1990-03-06
- 发明人: Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
- 申请人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
- 申请人地址： JPX Kyoto JPX Tokyo JPX Kadoma
- 专利权人： Dai-Ichi Kogyo Seiyaku Co., Ltd.,Dowa Mining Co., Ltd.,Matsushita Electric Industrial Co.
- 当前专利权人： Dai-Ichi Kogyo Seiyaku Co., Ltd.,Dowa Mining Co., Ltd.,Matsushita Electric Industrial Co.
- 当前专利权人地址： JPX Kyoto JPX Tokyo JPX Kadoma
- 主分类号： H01B1/22
- IPC分类号： H01B1/22 ; H01L23/498 ; H05K1/09
摘要：
A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
公开/授权文献
- US5482766A Deep-drawable film 公开/授权日：1996-01-09
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