公开(公告)号：US4865772A

公开(公告)日：1989-09-12

申请号：US271543

申请日：1988-11-15

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Yutaka Mitsune ,  Masami Sakuraba ,  Seiichi Nakatani ,  Tsutomu Nishimura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Yutaka Mitsune ,  Masami Sakuraba ,  Seiichi Nakatani ,  Tsutomu Nishimura

IPC分类号： C04B41/88 ,  C23C24/08 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.

摘要翻译： 一种含有55〜95重量％的无机粉末和45〜5重量％的有机介质的含铜厚膜导体组合物，所述无机粉末含有100重量份的铜粉，0.05〜3重量份 的氧化锌粉末，1〜7重量份的硼酸铅玻璃粉末，0.2〜5重量份的硼硅酸盐玻璃粉末和0〜10重量份的平均粒径不大于的锡粉末粉末 超过1.0亩。 本发明的组合物对于基材的可焊性和粘合强度优异。

公开(公告)号：US4906404A

公开(公告)日：1990-03-06

申请号：US267592

申请日：1988-11-07

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Yutaka Mitsune ,  Seiichi Nakatani ,  Tsutomu Nishimura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Yutaka Mitsune ,  Seiichi Nakatani ,  Tsutomu Nishimura

IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002

摘要： A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.

摘要翻译： 具有改善的可焊性以及良好粘合性的铜导体组合物，其包含铜粉末，无机粘合剂和诸如W，Mo，Ti，Ta，Nb或Cr的金属的硼化物或硅化物。 即使组合物重复进行烧制操作，可焊性也保持在良好的水平。

公开(公告)号：US4937016A

公开(公告)日：1990-06-26

申请号：US304631

申请日：1989-02-01

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Nobutoshi Kawamura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Nobutoshi Kawamura

IPC分类号： H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A copper conductor composition comprising a copper powder, an inorganic oxide powder, a glass powder and an organic vehicle, said copper powder having an average particle size of 0.5 to 3 .mu.m, a tap density of 3.0 to 5.0 g/cm.sup.3, and an oxygen content of 0.05 to 0.15% by weight. Zinc oxide powder and, optionally, nickel powder are used as the inorganic oxide powder. The composition which contains the copper powder having such an oxygen content as low as 0.05 to 0.15% by weight, can provide copper conductors having excellent conductor properties such as solderability, adhesive strength and matching property to resistances.

摘要翻译： 一种铜导体组合物，其包含铜粉末，无机氧化物粉末，玻璃粉末和有机载体，所述铜粉末的平均粒径为0.5〜3μm，振实密度为3.0〜5.0g / cm 3， 氧含量为0.05〜0.15重量％。 使用氧化锌粉末和任选的镍粉末作为无机氧化物粉末。 含有低至0.05-0.15重量％的氧含量的铜粉末的组合物可以提供具有优异的导电性能的铜导体，例如可焊性，粘合强度和与电阻的匹配性能。

公开(公告)号：US5035837A

公开(公告)日：1991-07-30

申请号：US544973

申请日：1990-06-28

申请人： Shuji Saeki ,  Masatoshi Suehiro ,  Masashi Echigo ,  Susumu Okada ,  Masami Sakuraba

发明人： Shuji Saeki ,  Masatoshi Suehiro ,  Masashi Echigo ,  Susumu Okada ,  Masami Sakuraba

IPC分类号： C04B41/88 ,  B22F1/00 ,  C04B35/45 ,  C04B35/636 ,  C22C32/00 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  B22F1/0059 ,  C04B35/45 ,  C04B35/6365 ,  C22C32/0021 ,  H01B1/16

摘要： A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

公开(公告)号：US5483106A

公开(公告)日：1996-01-09

申请号：US282006

申请日：1994-07-29

申请人： Masashi Echigo ,  Yoshitaka Nagayama ,  Takushi Maeda ,  Toshitaka Yamada ,  Masahiko Kitano

发明人： Masashi Echigo ,  Yoshitaka Nagayama ,  Takushi Maeda ,  Toshitaka Yamada ,  Masahiko Kitano

IPC分类号： H01L21/52 ,  G01L1/22 ,  G01P1/00 ,  G01P1/02 ,  G01P15/00 ,  H01L23/544 ,  H01L23/48 ,  H01L23/29 ,  H01L23/50

CPC分类号： H01L22/34 ,  G01L1/2293 ,  G01P1/006 ,  G01P1/023 ,  G01P15/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/14

摘要： In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.

摘要翻译： 在通过使用半导体粘合剂固定用于感测基板上的应力的传感器元件时，本发明旨在解决由于温度变化引起的基板侧施加的应力和在引线接合工艺中引线接合的缺陷的问题。 在配备有用于感测固定在基板上的应力的传感器元件的半导体器件中，使用半导体用粘合剂，其通过将由树脂制成的树脂珠与由柔性树脂制成的基底粘合剂混合而制备。

公开(公告)号：US06274821B1

公开(公告)日：2001-08-14

申请号：US09396426

申请日：1999-09-15

申请人： Masashi Echigo ,  Kaoru Nomoto ,  Masayuki Aoyama ,  Tadao Suzuki

发明人： Masashi Echigo ,  Kaoru Nomoto ,  Masayuki Aoyama ,  Tadao Suzuki

IPC分类号： H05K103

CPC分类号： H05K3/465 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0133 ,  Y10S428/901 ,  H01L2924/00

摘要： A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by &bgr;′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.

摘要翻译： 印刷电路板具有包括树脂材料的层，其在25℃的拉伸应变速率为40％/秒，拉伸断裂应变为约1％以上，艾佐德冲击强度为约1kgf。 cm 2以上，另外，通过β弛豫，树脂材料在-100℃〜-50℃的范围内具有0.05以上的动态损耗角正切峰值，峰值 在动态粘弹性光谱测量中通过β'松弛在0℃至100℃的范围内的0.02或更大的动态损耗角正切。 因此，可以提高印刷电路板的耐热冲击性和耐跌落冲击性。

公开(公告)号：US5946554A

公开(公告)日：1999-08-31

申请号：US863398

申请日：1997-05-27

申请人： Masashi Echigo ,  Hiroyuki Yamakawa

发明人： Masashi Echigo ,  Hiroyuki Yamakawa

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/58 ,  H01L23/31 ,  H05K3/28 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/8547 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/351

摘要： In a method of producing a resin-sealed electronic device, a solder resist layer including a silicone family surfactant is coated on a printed circuit board. Thereafter, an electronic component is mounted on the solder resist layer through adhesives, and is sealed by sealing resin. The content of the silicone family surfactant in the solder resist layer is less than 3 wt %, more preferably, is in a range of 0.2 wt % to 1 wt %. Accordingly, adhering reliability of the sealing resin relative to the solder resist can be improved, thereby resulting in high reliability of the resin-sealed electronic device for a long time.

摘要翻译： 在制造树脂密封电子器件的方法中，将包含硅酮族表面活性剂的阻焊层涂覆在印刷电路板上。 此后，通过粘合剂将电子部件安装在阻焊层上，并通过密封树脂密封。 阻焊层中硅酮族表面活性剂的含量小于3重量％，更优选在0.2重量％〜1重量％的范围内。 因此，可以提高密封树脂相对于阻焊剂的可靠性，从而长期使树脂密封电子器件具有高可靠性。