发明授权
- 专利标题: High density and high signal integrity connector
- 专利标题(中): 高密度和高信号完整性连接器
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申请号: US388832申请日: 1989-08-03
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公开(公告)号: US4911643A公开(公告)日: 1990-03-27
- 发明人: Michael Perry , Gary Yasumura
- 申请人: Michael Perry , Gary Yasumura
- 申请人地址: CA Menlo Park
- 专利权人: Beta Phase, Inc.
- 当前专利权人: Beta Phase, Inc.
- 当前专利权人地址: CA Menlo Park
- 主分类号: H01R13/03
- IPC分类号: H01R13/03 ; H01R4/01 ; H01R12/50 ; H01R12/62 ; H01R12/82 ; H01R12/83 ; H01R13/193 ; H01R24/00 ; H05K3/32 ; H05K3/36
摘要:
A high-performance, multi-row contact matrix electrical connector having a spring element in the form of an elongated hollow split tube with a heat-recoverable member of shape-memory alloy positioned within the tube and including first and second sets of parallel spaced conductors terminating at least at one end thereof in a first and second matrix of contact pads, the matrices and the pads being positioned within the split, a change in temperature changing the shape-memory alloy from one metallurgical state to another, causing movement of the heat-recoverable member and the spring means to open and close the connector.
公开/授权文献
- US5529964A Modified molecular sieves by means of solid ion exchange 公开/授权日:1996-06-25
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