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公开(公告)号：US11996642B2
公开(公告)日：2024-05-28
申请号：US18055577
申请日：2022-11-15
申请人： GITech Inc.
发明人： John Williams
CPC分类号： H01R12/7076 , H01R12/82 , H01R31/005
摘要： An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.
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公开(公告)号：US20230074818A1
公开(公告)日：2023-03-09
申请号：US18055577
申请日：2022-11-15
申请人： GITech Inc.
发明人： John Williams
摘要： An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.
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公开(公告)号：US20220336982A1
公开(公告)日：2022-10-20
申请号：US17231040
申请日：2021-04-15
摘要： An electronic assembly is provided and includes a host circuit board having an upper surface and board contacts on the upper surface. The upper surface has a mounting area. The electronic assembly includes a socket connector mounted to the host circuit board at the mounting area. The socket connector includes a socket housing holding a plurality of socket contacts. Each socket contact has an upper contact portion and a lower contact portion. The lower contact portion is electrically connected to the corresponding board contact of the host circuit board. The socket contact is compressible between the upper contact portion and the lower contact portion. The socket housing includes coolant channels configured to receive coolant. The electronic assembly includes an electronic package coupled to the socket connector. The electronic package has a lower surface and package contacts on the lower surface. The package contacts are electrically connected to the upper contact portions of the socket contacts.
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公开(公告)号：US10985480B2
公开(公告)日：2021-04-20
申请号：US16513188
申请日：2019-07-16
申请人： GITech Inc.
发明人： John Williams
摘要： An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.
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公开(公告)号：US20200185859A1
公开(公告)日：2020-06-11
申请号：US16705465
申请日：2019-12-06
申请人： LOTES CO., LTD
发明人： Zuo Feng Jin
IPC分类号： H01R13/631 , H01R12/71 , H01R13/11 , H01R13/639 , H01R12/82 , H01R12/70
摘要： An electrical connector includes: an insulating body; multiple terminals respectively accommodated in the insulating body; a cover covering the insulating body in a front-rear sliding manner and having a hollow portion to accommodate a mating plug including a substrate and multiple conducting portions; and a driving member. Each terminal has a contact portion. The hollow portion has a virtual center line extending in a left-right direction. The cover ihas a pulling portion located in front of the virtual center line to abut the substrate forward. The driving member has a driving portion located in front of the hollow portion. After the substrate is mounted downward into the hollow portion, the driving portion drives the cover to move horizontally forward relative to the insulating body, and the pulling portion pulls the substrate forward, such that the conducting portions move forward to be in contact with the contact portions of the terminals.
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公开(公告)号：US10522925B2
公开(公告)日：2019-12-31
申请号：US15945767
申请日：2018-04-05
发明人： Matthew Jeffrey Sypolt , Chad William Morgan , John Joseph Consoli , Margaret Mahoney Fernandes
IPC分类号： H01R13/6585 , H01R12/73 , H01R13/6582 , H01R13/11 , H01R12/70 , H05K1/14 , H05K7/14 , H01R13/631 , H01R12/82 , H01R13/658 , H01R13/6587 , H01R13/6594 , H01R12/52 , H01R13/6586 , H01R24/00
摘要： A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.
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公开(公告)号：US20190052004A1
公开(公告)日：2019-02-14
申请号：US16056123
申请日：2018-08-06
发明人： Yohei HASEGAWA , Takahiro ABE
CPC分类号： H01R12/716 , H01R12/57 , H01R12/65 , H01R12/7005 , H01R12/73 , H01R12/79 , H01R12/82 , H01R12/91 , H01R13/405 , H01R13/62 , H01R43/205 , H01R43/24
摘要： Electrical connector for circuit boards provided with terminals having connecting portions configured to be connected to a circuit board at one end in the longitudinal direction of said terminals and contact portions configured to be placed in contact with a counterpart connector component at the other end, and a housing holding a plurality of said terminals in place in array form. Said housing having disposed therein the contact portions of the terminals, and formed such that it is divided into a receiving-side housing, which accommodates the contact portions and receives a counterpart connector component such that it is placed in contact with the contact portions, and a board-side housing, which holds the terminals in place in sections more proximal to the connecting portions than to the contact portions and which is mounted to a circuit board, and the receiving-side housing and the board-side housing are molded as a single unit.
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公开(公告)号：US20180166815A1
公开(公告)日：2018-06-14
申请号：US15840161
申请日：2017-12-13
发明人： Rainer Bussmann , Marc Lindkamp
IPC分类号： H01R12/82 , H01R12/70 , H01R4/2429 , H01R12/67 , H01R9/03
CPC分类号： H01R12/82 , H01R4/2429 , H01R9/031 , H01R9/095 , H01R12/675 , H01R12/7094 , H01R12/716 , H01R13/4368 , H01R13/621 , H01R13/64 , H01R43/205 , H01R43/24 , H05K3/306 , H05K3/3447 , H05K3/366 , H05K2201/10189 , H05K2201/10295 , H05K2201/10356 , H05K2201/10409 , H05K2201/10598
摘要： A connector for installation on a printed circuit board a contacting part has which includes at least two contact elements, each of which can be connected, on the connection side, to an individual conductor and, on the plug-in side, to a conductive track of the printed circuit board, wherein the connector a connection part which encloses the individual conductors and, in the region of each individual conductor, has a recess, into each of which a contact element engages for the electrical connection between individual conductor and contact element. The contacting part is formed in an injection molding process, wherein at least two contact elements having an insulation-displacement connector are inserted or engaged in the contacting part or are directly encapsulated, and the connection part is formed in an injection molding process, wherein at least two individual conductors, each having a cable sheath, are thus placed in an injection molding tool and are encapsulated.
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公开(公告)号：US20170301600A1
公开(公告)日：2017-10-19
申请号：US15487519
申请日：2017-04-14
发明人： Thomas FRANK , Christian WALTER , Stefan WEISS , Thomas ZIEGLER
IPC分类号： H01L23/32 , B60K1/04 , H01R13/73 , H01R12/70 , B60K1/02 , B66F9/075 , B60K7/00 , H01L23/367 , H01R12/82
CPC分类号： H01L23/32 , B60K1/02 , B60K1/04 , B60K7/0007 , B60K2007/0061 , B66F9/07572 , H01L23/3672 , H01L2224/18 , H01L2224/24137 , H01L2224/4846 , H01L2224/48472 , H01L2224/73267 , H01R12/7047 , H01R12/82 , H01R13/73 , H01R2201/26 , H05K7/1432
摘要： A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.
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公开(公告)号：US09343828B2
公开(公告)日：2016-05-17
申请号：US14221585
申请日：2014-03-21
申请人： AVX Corporation
发明人： Peter Bishop
CPC分类号： H01R4/4845 , H01R4/22 , H01R4/4818 , H01R4/4836 , H01R12/82 , H01R43/20 , Y10T29/4922
摘要： An apparatus includes an insulated body, a conductive contact disposed in the insulated body, and a button disposed on the insulated body. The insulated body can receive a wire through an opening in the insulated body. The conductive contact contacts the wire and secures the wire through a compression force exerted on the wire. The button has a neutral position and a depressed position, and the button in the depressed position is configured to reduce the compression force exerted on the wire.
摘要翻译： 一种设备包括绝缘体，设置在绝缘体中的导电触点和设置在绝缘体上的按钮。 绝缘体可以通过绝缘体中的开口接收电线。 导电触点接触线，并通过施加在线上的压缩力来固定线。 按钮具有中立位置和按压位置，并且按压位置处的按钮构造成减小施加在线上的压缩力。
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