发明授权
- 专利标题： Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
- 专利标题（中）： 调节非导电基底，以便随后在其上选择性沉积金属
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申请号： US156519申请日： 1988-02-16
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公开(公告)号： US4948707A公开(公告)日： 1990-08-14
- 发明人: Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
- 申请人： Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C23C18/18
- IPC分类号： C23C18/18 ; C23C18/28 ; C23C18/30 ; H05K3/00 ; H05K3/18 ; H05K3/38
摘要：
A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.
公开/授权文献
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