- 专利标题: Bonding method and adhesive useful for the method
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申请号: US229458申请日: 1988-08-08
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公开(公告)号: US4950701A公开(公告)日: 1990-08-21
- 发明人: Naomi Okamura , Hiroshi Aoki , Junzo Makino , Hajime Yagi , Yasuo Arai , Takashi Yamanaka
- 申请人: Naomi Okamura , Hiroshi Aoki , Junzo Makino , Hajime Yagi , Yasuo Arai , Takashi Yamanaka
- 申请人地址: JPX Tokyo
- 专利权人: Cemedine Company, Ltd.
- 当前专利权人: Cemedine Company, Ltd.
- 当前专利权人地址: JPX Tokyo
- 主分类号: C08L35/04
- IPC分类号: C08L35/04 ; C08L83/04 ; C09J5/04
摘要:
A method for bonding two objects by means of the following two adhesives:(A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound of the formula: ##STR1## wherein R is an alkyl group having from 1 to 16 carbon atoms, an alkoxyalkyl group having 2 to 16 carbon atoms, a haloalkyl group having from 1 to 16 carbon atoms, a cyanoalkyl group having from 2 to 16 carbon atoms, an aralkyl group having from 6 to 12 atoms, an acyloxyalkyl group having from 2 to 16 carbon atoms, a cycloalkyl group having from 3 to 16 carbon atoms, an alkenyl group having from 2 to 16 carbon atoms or an aryl group having from 6 to 12 carbon atoms, and a 1,1-disubstituted diene compound of the formula: ##STR2## wherein each of R.sup.1 and R.sup.2 which may be the same or different, is a hydrogen atom, an alkyl group having from 1 to 5 carbon atoms, an aryl group, an aralkyl group having from 6 to 12 carbon atoms or a halogen atom, R.sup.3 is a hydrogen atom or a methyl group, each of X and Y which may be the same or different, is a cyano group, a carboxylic acid ester group having from 2 to 12 carbon atoms, an ethylsulfone group, a phenylsulfone group, a formyl group, an acetyl group, a benzoyl group, an amide group, a diethyl sulfonyl group, or a phenyl group; and(B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
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