发明授权
- 专利标题： Semiconductor device and method of mounting the semiconductor device
- 专利标题（中）： 半导体装置及其安装方法
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申请号： US489714申请日： 1990-02-28
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公开(公告)号： US4965653A公开(公告)日： 1990-10-23
- 发明人: Kanji Otsuka , Shigeo Kuroda , Katsuyuki Sato , Hisashi Nakamura , Shinichi Shouji
- 申请人： Kanji Otsuka , Shigeo Kuroda , Katsuyuki Sato , Hisashi Nakamura , Shinichi Shouji
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi VLSI Engineering Corp.
- 当前专利权人： Hitachi, Ltd.,Hitachi VLSI Engineering Corp.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX62-157647 19870626; JPX62-157649 19870626; JPX62-223962 19870909; JPX62-257121 19871014
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/00 ; H01L23/32 ; H01L23/498 ; H01L25/065 ; H01L29/06
摘要：
The present invention discloses a suitable mounting of a wafer scale LSI (wafer scale integration) (WSI) in which a slit formed in a wafer is fit to a connector, a U-shaped reinforcing rubber member is disposed at the circumferential edge of the wafer, or a flexible adhesive is used for bonding a substrate formed with through-holes and a wafer, to provide a WSI mounting structure of high integration degree and high reliability. Furthermore, a method of efficient mounting by conducting the wiring of the wafer and the connection with the external terminal of the chip in one identical production step is disclosed.
公开/授权文献
- US5545941A Crystal oscillator circuit 公开/授权日：1996-08-13
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