公开(公告)号：US4965653A

公开(公告)日：1990-10-23

申请号：US489714

申请日：1990-02-28

申请人： Kanji Otsuka ,  Shigeo Kuroda ,  Katsuyuki Sato ,  Hisashi Nakamura ,  Shinichi Shouji

发明人： Kanji Otsuka ,  Shigeo Kuroda ,  Katsuyuki Sato ,  Hisashi Nakamura ,  Shinichi Shouji

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/32 ,  H01L23/498 ,  H01L25/065 ,  H01L29/06

CPC分类号： H01L23/562 ,  H01L23/32 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/32 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2223/54493 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18162

摘要： The present invention discloses a suitable mounting of a wafer scale LSI (wafer scale integration) (WSI) in which a slit formed in a wafer is fit to a connector, a U-shaped reinforcing rubber member is disposed at the circumferential edge of the wafer, or a flexible adhesive is used for bonding a substrate formed with through-holes and a wafer, to provide a WSI mounting structure of high integration degree and high reliability. Furthermore, a method of efficient mounting by conducting the wiring of the wafer and the connection with the external terminal of the chip in one identical production step is disclosed.

摘要翻译： 本发明公开了一种晶片规模LSI（晶片规模集成）（WSI）的合适安装，其中形成在晶片中的狭缝与连接器配合，U形加强橡胶件设置在晶片的周边边缘 或柔性粘合剂用于接合形成有通孔和晶片的基板，以提供高集成度和高​​可靠性的WSI安装结构。 此外，公开了通过在一个相同的制造步骤中导通晶片的布线和与芯片的外部端子的连接来有效地安装的方法。