发明授权
- 专利标题: Power and signal line bussing method for memory devices
- 专利标题(中): 用于存储器件的电源和信号线总线方法
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申请号: US330917申请日: 1989-03-31
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公开(公告)号: US5007025A公开(公告)日: 1991-04-09
- 发明人: Sang K. Hwang , Tae S. Jung , Kyu H. Choi
- 申请人: Sang K. Hwang , Tae S. Jung , Kyu H. Choi
- 申请人地址: KRX Suwon
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KRX Suwon
- 优先权: KRX88-9162 19880721
- 主分类号: G11C11/41
- IPC分类号: G11C11/41 ; G11C5/02 ; G11C5/14 ; G11C11/34 ; G11C11/401 ; H01L21/822 ; H01L27/04 ; H01L27/10
摘要:
A memory cell device having circuitry located between memory cell arrays comprises power and ground lines to the circuitry formed directly above the memory cell arrays. The power and ground lines are parallel and positioned in an adjacent alternating pattern such that a power line is positioned adjacent a ground line, which is positioned adjacent another power line and so on. Signal lines carrying signals to and from the circuitry are also formed directly above memory cell arrays.
公开/授权文献
- US5490785A Automotive splice connector 公开/授权日:1996-02-13
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