发明授权
- 专利标题: High-frequency amplifying semiconductor device
- 专利标题(中): 高频放大半导体器件
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申请号: US436056申请日: 1989-11-09
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公开(公告)号: US5021859A公开(公告)日: 1991-06-04
- 发明人: Takahiro Ito , Bunshiro Yamaki , Yoshio Yamamoto
- 申请人: Takahiro Ito , Bunshiro Yamaki , Yoshio Yamamoto
- 申请人地址: JPX Kawasaki
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX63-284772 19881110
- 主分类号: H01L29/73
- IPC分类号: H01L29/73 ; H01L21/331 ; H01L21/8249 ; H01L27/06 ; H01L29/732
摘要:
In a high-frequency amplifying semiconductor device in which a MOS field effect transistor and a bipolar transistor are formed within the same wafer and a source electrode of the MOS field effect transistor is connected to a lead frame by a bonding wire, use is made of a wafer for fabricating the MOS field effect transistor and the bipolar transistor, in which on a semiconductor substrate of P++ type is formed a first epitaxial layer of P or P- type, a buried layer of N+ type is formed in the first epitaxial layer of the first conductivity type and a second epitaxial layer of P type is formed on the buried layer and the first epitaxial layer. The use of such a wafer, which has no P- type Si substrate, allows the source resistance of the MOS field effect transistor to be decreased. The high-frequency amplifying semiconductor device is improved in high-frequency gain and NF.
公开/授权文献
- US4523591A Polymers for injection molding of absorbable surgical devices 公开/授权日:1985-06-18
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