发明授权
- 专利标题: Modular jack patching device
- 专利标题(中): 模块插座修补装置
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申请号: US604770申请日: 1990-10-26
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公开(公告)号: US5074801A公开(公告)日: 1991-12-24
- 发明人: John A. Siemon
- 申请人: John A. Siemon
- 申请人地址: CT Watertown
- 专利权人: The Siemon Company
- 当前专利权人: The Siemon Company
- 当前专利权人地址: CT Watertown
- 主分类号: H01R13/70
- IPC分类号: H01R13/70 ; H01R13/703 ; H01R31/02 ; H04Q1/02
摘要:
A novel patching device comprises discrete modules, each having a unitary molded housing which incorporates a pair of oppositely disposed (e.g., back-to-back) standard female modular jacks on a front face thereof. A rear face of the housing includes retaining means for retaining a printed circuit board having circuitry associated therewith which normally maintains a constant electrical interconnection between respective conductive pins in each of the jacks. This normally constant interconnection is interrupted or "pre-empted" when a known and standard modular plug is inserted into a jack whereby the resilient conductive pins are urged outwardly from contact with the printed circuit board. Each discrete module includes novel snap fitting means which permits disengageable snap fit attachment to an opening of a panel. Significantly, the module may be snap fit either from the front or opposed rear planar surface of the panel.
公开/授权文献
- US5673640A Mohair quilted garment insert and method of fabrication 公开/授权日:1997-10-07
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