发明授权
- 专利标题: Package for a light-responsive semiconductor chip
- 专利标题(中): 用于光反应半导体芯片的封装
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申请号: US561578申请日: 1990-08-02
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公开(公告)号: US5087964A公开(公告)日: 1992-02-11
- 发明人: Muneo Hatta
- 申请人: Muneo Hatta
- 申请人地址: JPX
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JPX
- 优先权: JPX1-285224 19891031
- 主分类号: H01L23/02
- IPC分类号: H01L23/02 ; H01L27/14 ; H01L31/02 ; H01L31/0203 ; H01L31/0216
摘要:
A semiconductor device having a semiconductor chip packaged in a semiconductor container, which operates in receiving visible light, near infrared light and ultraviolet light, the semiconductor device includes a lower plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the semiconductor chip, the semiconductor chip mounted on the lower plate, a middle plate comprising a single-layer or a multiple-layer wiring board, and an upper plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the lower plate and having a window for incident light at one part thereof, in which the lower plate and the upper plate are bonded with putting the middle plate therebetween and an upper part of the upper plate is sealed by a lid formed of glass or a synthetic resin.
公开/授权文献
- US6034138A Disinfectant composition 公开/授权日:2000-03-07