公开(公告)号：US5126828A

公开(公告)日：1992-06-30

申请号：US501211

申请日：1990-03-29

申请人： Muneo Hatta ,  Susumu Takeuchi ,  Hiroshi Tobimatsu

发明人： Muneo Hatta ,  Susumu Takeuchi ,  Hiroshi Tobimatsu

IPC分类号： H01L21/822 ,  H01L21/60 ,  H01L21/66 ,  H01L23/485 ,  H01L23/50 ,  H01L23/58 ,  H01L27/04 ,  H01L29/06

CPC分类号： H01L29/0657 ,  H01L22/32 ,  H01L24/05 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312

摘要： A WSI device comprises a semiconductor substrate having a wafer scale size. An integrated circuit having a unified function is formed on a main surface of the semiconductor substrate. The semiconductor substrate defines various cutouts centrally and/or peripherally thereof. The cutouts serve to extend peripheral regions of the semiconductor substrate. Bonding pads are formed along the extended peripheral regions of the semiconductor substrate. As a result, the number of bonding pads that can be formed is increased to promote multi-functioning of the WSI device.

摘要翻译： WSI器件包括具有晶片刻度尺寸的半导体衬底。 具有统一功能的集成电路形成在半导体衬底的主表面上。 半导体衬底在其中心和/或周边限定各种切口。 切口用于延伸半导体衬底的周边区域。 沿着半导体衬底的延伸的周边区域形成接合焊盘。 结果，可以形成的接合焊盘的数量增加，以促进WSI器件的多功能化。

公开(公告)号：US5087964A

公开(公告)日：1992-02-11

申请号：US561578

申请日：1990-08-02

申请人： Muneo Hatta

发明人： Muneo Hatta

IPC分类号： H01L23/02 ,  H01L27/14 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216

CPC分类号： H01L31/0203 ,  H01L31/02164 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/3025

摘要： A semiconductor device having a semiconductor chip packaged in a semiconductor container, which operates in receiving visible light, near infrared light and ultraviolet light, the semiconductor device includes a lower plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the semiconductor chip, the semiconductor chip mounted on the lower plate, a middle plate comprising a single-layer or a multiple-layer wiring board, and an upper plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the lower plate and having a window for incident light at one part thereof, in which the lower plate and the upper plate are bonded with putting the middle plate therebetween and an upper part of the upper plate is sealed by a lid formed of glass or a synthetic resin.