A printed circuit board inspecting apparatus, in which image data of a packaged circuit board under inspection obtained by picking up the image of the circuit board are processed through predetermined processing procedure for examining packaged states of parts mounted on the packaged cicuit board. The apparatus comprises an imaging unit for picking up the image of a packaged circuit board, a decision unit for deciding the state of the parts mounted on the packaged circuit board, and a visualizing unit for displaying visibly the result of the decision and position of the relevant part in correspondence with each other. The apparatus can further include a land extracting unit for extracting lands from the image obtained through the imaging of the packaged circuit board under inspection, an alarm condition setting unit for setting the condition for generating an alarm, and an alarm generating unit for generating the alarm when the alarm condition is met by the result of decision made by the decision unit.