发明授权
- 专利标题： Semiconductor protection device
- 专利标题（中）： 半导体保护器件
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申请号： US326343申请日： 1989-03-21
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公开(公告)号： US5148249A公开(公告)日： 1992-09-15
- 发明人: Takeshi Koyama
- 申请人： Takeshi Koyama
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX63-90213 19880414
- 主分类号： H01L23/62
- IPC分类号： H01L23/62 ; H01L21/822 ; H01L27/02 ; H01L27/04 ; H01L29/417 ; H01L29/861 ; H01L29/866
摘要：
A semiconductor device constitutes a protection diode including a second region of first conductivity type beneath a marginal portion of an interconnection pad which is not utilized for bonding. The second region, together with an area of second conductivity type, constitutes the protection diode for protection against a possible negative surge voltage.
公开/授权文献
- US6149358A Apparatus for releasably clamping workpieces 公开/授权日：2000-11-21
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