发明授权
- 专利标题: Contact forming material for a vacuum interrupter
- 专利标题(中): 与真空中断器接触形成材料
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申请号: US386264申请日: 1989-07-28
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公开(公告)号: US5149362A公开(公告)日: 1992-09-22
- 发明人: Tsutomu Okutomi , Atsushi Yamamoto , Seishi Chiba , Tsuneyo Seki , Mikio Okawa , Mitsutaka Honma , Kiyofumi Otobe , Yoshinari Satoh , Tadaaki Sekiguchi
- 申请人: Tsutomu Okutomi , Atsushi Yamamoto , Seishi Chiba , Tsuneyo Seki , Mikio Okawa , Mitsutaka Honma , Kiyofumi Otobe , Yoshinari Satoh , Tadaaki Sekiguchi
- 申请人地址: JPX
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX
- 优先权: JPX63-205965 19880819
- 主分类号: H01H33/66
- IPC分类号: H01H33/66 ; H01H1/02 ; H01H1/0233
摘要:
An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.
公开/授权文献
- US5564980A Room air quality conditioning system 公开/授权日:1996-10-15
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