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1.发明授权
公开(公告)号：US5403543A
公开(公告)日：1995-04-04
申请号：US893017
申请日：1992-06-03
申请人： Tsutomu Okutomi , Tsuneyo Seki , Atsushi Yamamoto , Mikio Okawa , Tadaaki Sekiguchi , Yoshiko Majima
发明人： Tsutomu Okutomi , Tsuneyo Seki , Atsushi Yamamoto , Mikio Okawa , Tadaaki Sekiguchi , Yoshiko Majima
CPC分类号： B22F1/0088 , C22C1/04 , H01H1/0206
摘要： Disclosed is a manufacturing process of an alloy material comprising a chromium component and a base component which comprises at least one element selected from tile group consisting of copper and silver, the manufacturing process comprising steps of: subjecting a chromium material with a carbon material to heat treatment; and manufacturing the alloy material using the chromium material treated at the heat treatment subjecting step and a raw material for tile base component. At the heat treatment subjecting step, the chromium material, mixed with 50 ppm to 5,000 ppm of the carbon material, is heated to a temperature within the range of 800.degree. C. to 1,400.degree. C. in a non-oxidizing atmosphere. According to this manufacturing process, the level of oxygen content in the alloy material are decreased to be not more than 200 ppm. The obtained alloy material can be used as a contact material for vacuum circuit breakers.
摘要翻译： 公开了包含铬成分和碱成分的合金材料的制造方法，其包含选自由铜和银组成的瓷砖组中的至少一种元素，所述制造方法包括以下步骤：使具有碳材料的铬材料加热 治疗; 并且使用在热处理步骤中处理的铬材料和用于瓦片基础成分的原料来制造合金材料。 在热处理工序中，在非氧化性气氛中将与50ppm〜5,000ppm的碳材料混合的铬材料加热至800〜1400℃的温度。 根据该制造方法，合金材料中的氧含量降低到不大于200ppm。 所获得的合金材料可以用作真空断路器的接触材料。
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公开(公告)号：US6024896A
公开(公告)日：2000-02-15
申请号：US37032
申请日：1998-03-09
CPC分类号： C22C29/08 , H01H1/0203
摘要： The contacts material of the present invention is contacts material including silver-tungsten carbide alloy containing 55-70 weight % of tungsten carbide (WC) of mean particle size 0.1-6 .mu.m wherein is included 0.005-0.2 weight % of carbon in an undissolved state or non-compound state whose equivalent diameter is 0.01-5 .mu.m.The present invention enables the current interruption characteristics of contacts material to be improved.
摘要翻译： 本发明的接触材料是包含含有55-70重量％的平均粒度为0.1-6μm的碳化钨（WC）的银 - 碳化钨合金的接触材料，其中在未溶解的碳含量中含有0.005-0.2重量％的碳 状态或非复合状态，其当量直径为0.01-5μm。 本发明能够提高触点材料的电流中断特性。
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公开(公告)号：US5246512A
公开(公告)日：1993-09-21
申请号：US711072
申请日：1991-06-06
CPC分类号： H01H11/048 , H01H1/0206
摘要： The present invention relates to a contact for a vacuum interrupter obtained by processing a contact-forming material comprising from 20% to 60% by weight of Cr, Bi in an amount of from 0.05% to 1.0% by weight of the total amount of Cu and Bi, and the balance substantially Cu into the shape of a contact, and thereafter subjecting the processed material to vacuum heat treatment. The contact for the vacuum interrupter has both excellent anti-welding characteristics and excellent voltage withstanding characteristics.
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公开(公告)号：US5149362A
公开(公告)日：1992-09-22
申请号：US386264
申请日：1989-07-28
申请人： Tsutomu Okutomi , Atsushi Yamamoto , Seishi Chiba , Tsuneyo Seki , Mikio Okawa , Mitsutaka Honma , Kiyofumi Otobe , Yoshinari Satoh , Tadaaki Sekiguchi
发明人： Tsutomu Okutomi , Atsushi Yamamoto , Seishi Chiba , Tsuneyo Seki , Mikio Okawa , Mitsutaka Honma , Kiyofumi Otobe , Yoshinari Satoh , Tadaaki Sekiguchi
IPC分类号： H01H33/66 , H01H1/02 , H01H1/0233
CPC分类号： H01H1/0203 , H01H1/0233 , Y10T428/12049
摘要： An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.
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公开(公告)号：US4830821A
公开(公告)日：1989-05-16
申请号：US224401
申请日：1988-07-26
申请人： Tsutomu Okutomi , Seishi Chiba , Mikio Okawa , Tadaaki Sekiguchi , Hiroshi Endo , Tsutomu Yamashita
发明人： Tsutomu Okutomi , Seishi Chiba , Mikio Okawa , Tadaaki Sekiguchi , Hiroshi Endo , Tsutomu Yamashita
CPC分类号： C22C1/0475 , H01H1/0206
摘要： A contact forming material for a vacuum valve or vacuum circuit breaker comprising (a) a conductive material consisting of copper and/or silver, and (b) an arc-proof material consisting of chromium, titanium, zirconium, or an alloy thereof wherein the amount of said arc-proof material present in said conductive material matrix is no more than 0.35% by weight. This contact forming material is produced by a process which comprises the steps of compacting arc-proof material powder into a green compact, sintering said green compact to obtain a skeleton of the arc-proof material, infiltrating the voids of said skeleton with a conductive material, and cooling the infiltrated material. The contact forming material can provide contacts for a vacuum valve or vacuum circuit breaker which has excellent characteristics such as temperature rise characteristic and contact resistance characteristic.
摘要翻译： 一种用于真空阀或真空断路器的接触形成材料，包括（a）由铜和/或银组成的导电材料，和（b）由铬，钛，锆或其合金组成的防弧材料，其中 存在于所述导电材料基体中的所述防弧材料的量不大于0.35重量％。 该接触形成材料通过以下步骤制造，该方法包括以下步骤：将抗电弧材料粉末压实成生坯，烧结所述生坯以获得防弧材料的骨架，用导电材料渗透所述骨架的空隙 ，并冷却渗透的材料。 接触形成材料可以提供具有诸如温度上升特性和接触电阻特性等优异特性的真空阀或真空断路器的触头。
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公开(公告)号：US4777335A
公开(公告)日：1988-10-11
申请号：US4904
申请日：1987-01-20
申请人： Tsutomu Okutomi , Seishi Chiba , Mikio Okawa , Tadaaki Sekiguchi , Hiroshi Endo , Tsutomu Yamashita
发明人： Tsutomu Okutomi , Seishi Chiba , Mikio Okawa , Tadaaki Sekiguchi , Hiroshi Endo , Tsutomu Yamashita
CPC分类号： C22C1/0475 , H01H1/0206
摘要： A contact forming material for a vacuum valve or vacuum circuit breaker comprising (a) a conductive material consisting of copper and/or silver, and (b) an arc-proof material consisting of chromium, titanium, zirconium, or an alloy thereof wherein the amount of said arc-proof material present in said conductive material matrix is no more than 0.35% by weight. This contact forming material is produced by a process which comprises the steps of compacting arc-proof material powder into a green compact, sintering said green compact to obtain a skeleton of the arc-proof material, infiltrating the voids of said skeleton with a conductive material, and cooling the infiltrated material. The contact forming material can provide contacts for a vacuum valve or vacuum circuit breaker which has excellent characteristics such as temperature rise characteristic and contact resistance characteristic.
摘要翻译： 一种用于真空阀或真空断路器的接触形成材料，包括（a）由铜和/或银组成的导电材料，和（b）由铬，钛，锆或其合金组成的防弧材料，其中 存在于所述导电材料基体中的所述防弧材料的量不大于0.35重量％。 该接触形成材料通过以下步骤制造，该方法包括以下步骤：将抗电弧材料粉末压实成生坯，烧结所述生坯以获得防弧材料的骨架，用导电材料渗透所述骨架的空隙 ，并冷却渗透的材料。 接触形成材料可以提供具有诸如温度上升特性和接触电阻特性等优异特性的真空阀或真空断路器的触头。
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公开(公告)号：US4027134A
公开(公告)日：1977-05-31
申请号：US721956
申请日：1976-09-10
CPC分类号： B23H1/06
摘要： An electrode for electrical discharge machining formed of a tungsten-based alloy including Ag and/or Cu, 15 to 40% by weight, and ZrO.sub.2, 0.5 to 10% by weight.
摘要翻译： 一种由包含Ag和/或Cu的钨基合金形成的放电加工用电极，其为15〜40重量％，ZrO 2为0.5〜10重量％。
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公开(公告)号：US5045281A
公开(公告)日：1991-09-03
申请号：US486259
申请日：1990-02-27
申请人： Tsutomu Okutomi , Mikio Okawa , Atsushi Yamamoto , Tsuneyo Seki , Yoshinari Satoh , Mitsutaka Honma , Seishi Chiba , Tadaaki Sekiguchi
发明人： Tsutomu Okutomi , Mikio Okawa , Atsushi Yamamoto , Tsuneyo Seki , Yoshinari Satoh , Mitsutaka Honma , Seishi Chiba , Tadaaki Sekiguchi
IPC分类号： C22C5/08 , C22C1/04 , C22C14/00 , C22C16/00 , C22C27/02 , C22C27/04 , C22C27/06 , C22C29/08 , C22C29/14 , H01H1/02 , H01H1/0233 , H01H33/66
CPC分类号： H01H1/0203 , H01H1/0233
摘要： A contact forming material for a vacuum interrupter comprising: from 25% to 65% by weight of a highly conductive component comprising Ag and Cu, and from 35% to 75% by weight of an arc-proof component selected from the group consisting of Ti, V, Cr, Zr, Mo, W and their carbides and borides, and mixtures thereof wherein the highly conductive component of the contact forming material comprises (i) a first highly conductive component region composed of a first discontinuous phase having a thickness or width of no more than 5 micrometers and a first matrix surrounding the first discontinuous phase, and (ii) a second highly conductive component region composed of a second discontinuous phase having a thickness or width of at least 5 micrometers and a second matrix surrounding the second discontinuous phase, wherein the first discontinuous phase in the first highly conductive component region is finely and uniformly dispersed in the first matrix at intervals of no more than 5 micrometers, and wherein the amount of the second highly conductive component region based on the total highly conductive component is within the range of from 10% to 60% by weight.
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