发明授权
US5156727A Film thickness uniformity control apparatus for in-line sputtering
systems
失效
薄膜厚度均匀控制装置，用于在线喷涂系统
- 专利标题： Film thickness uniformity control apparatus for in-line sputtering systems
- 专利标题（中）： 薄膜厚度均匀控制装置，用于在线喷涂系统
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申请号： US596853申请日： 1990-10-12
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公开(公告)号： US5156727A公开(公告)日： 1992-10-20
- 发明人: Erik J. Bjornard , Michael J. Valiska , Clifford L. Taylor
- 申请人： Erik J. Bjornard , Michael J. Valiska , Clifford L. Taylor
- 申请人地址： MN Faribault
- 专利权人： Viratec Thin Films, Inc.
- 当前专利权人： Viratec Thin Films, Inc.
- 当前专利权人地址： MN Faribault
- 主分类号： C23C14/04
- IPC分类号： C23C14/04 ; H01J37/34
摘要：
A mask arrangement is located between the cathode and substrate in an in-line sputtering system. The relative shape of the mask may be changed from outside the system. Thus, film thickness uniformity can be modified and controlled without interrupting the sputtering process.
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