发明授权
- 专利标题： Semiconductor device card and method of manufacturing the same
- 专利标题（中）： 半导体器件卡及其制造方法
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申请号： US674167申请日： 1991-03-25
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公开(公告)号： US5173841A公开(公告)日： 1992-12-22
- 发明人: Takeshi Uenaka , Jun Ohbuchi , Hajime Maeda , Toru Tachikawa , Shigeo Onoda
- 申请人： Takeshi Uenaka , Jun Ohbuchi , Hajime Maeda , Toru Tachikawa , Shigeo Onoda
- 申请人地址： JPX
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX
- 优先权： JPX2-78294 19900326
- 主分类号： B42D15/10
- IPC分类号： B42D15/10 ; B42D15/00 ; G06K19/077 ; H05K5/02 ; H05K7/14
摘要：
A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.
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