公开(公告)号：US5719746A

公开(公告)日：1998-02-17

申请号：US587928

申请日：1996-01-17

申请人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

发明人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/026 ,  G06K19/07745 ,  H01L2924/0002

摘要： An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

摘要翻译： IC卡包括具有电路的模块和彼此粘附的两个面板以覆盖它们之间的模块。 两个面板用粘合剂粘附，具有足够的粘附强度，并将模块没有空气通道密封到IC卡的外部。 IC卡的密封密封以各种方式实现。 例如，具有变化的宽度的凹槽设置在用于施加粘合剂的一个面板中，而在另一个面板中设置与凹槽接合的凹槽。 当两个板彼此粘合时，可以在槽中形成具有较窄宽度的部分的气体通道，而具有较宽宽度的部分中的沟槽中的粘合剂由于粘度而填充气体通道。 另一方面，设置在一个面板中的突起具有与设置在另一个面板中的凹槽相对的边缘。 因此，凹槽保持气密。 以不同的方式，使用在固化温度下具有高粘度的粘合剂。 以不同的方式，填充IC卡内的所有空间，或者在两个面板周围的周围的空间中填充足够量的粘合剂。 另一方面，面板被粘附在恒温器中。 在另一方面，面板在其周边处熔化粘附。

公开(公告)号：US5521433A

公开(公告)日：1996-05-28

申请号：US408300

申请日：1995-03-22

申请人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

发明人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06K19/02 ,  G06K19/077 ,  H01L23/12 ,  H01L23/538 ,  H01L25/00 ,  H05K1/03 ,  H05K1/05 ,  H01L23/02 ,  H01L23/053

CPC分类号： G06K19/07728 ,  G06K19/02 ,  G06K19/077 ,  G06K19/0773 ,  H01L23/5388 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/056 ,  H05K2201/0215 ,  H05K2201/0281

摘要： An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

摘要翻译： IC卡包括具有由树脂和金属纤维的混合物制成的金属纤维树脂材料层和导电图案的基板。 导电图案和金属纤维树脂材料层通过抗蚀剂膜彼此电绝缘。 提高了IC卡的散热和机械强度。

公开(公告)号：US4868714A

公开(公告)日：1989-09-19

申请号：US175195

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G11C5/00 ,  H01R13/453

CPC分类号： H01R13/4534 ,  G06K19/077

摘要： An IC card having a package in which a semiconductor device is accommodated, a plurality of electrode terminals disposed on a surface of the package near the front end thereof in the direction in which the IC card is inserted into a connector in an external device, a shutter supported on the surface of a front portion of the package for exposing and covering the electrode terminals, the shutter having a width smaller than that of the package as measured in the direction perpendicular to the direction of insertion into the connector, a pair of guide projections formed on the shutter at both-sides thereof to extend into the package, the guide projections functioning to open the shutter by abutting against a pair of shutter receiving pins disposed in the insertion hole of the connector when the package is inserted into the connector, and a pair of guide grooves adapted to guide the guide projections, the guide grooves being formed in both sides of the front portion of the surface of the package to be within the side surfaces thereof, the guide grooves extending from the front side of the package in the insertion direction thereof.

摘要翻译： 具有容纳半导体装置的封装的IC卡，在IC卡插入到外部装置的连接器的方向上，在其前端附近设置在封装体的表面附近的多个电极端子， 支撑在封装的前部表面上的遮光板用于曝光和覆盖电极端子，该遮板的宽度小于在垂直于插入连接器的方向的方向上测量的包装的宽度;一对导向件 突起形成在挡板的两侧以延伸到包装中，引导突起用于当包装被插入连接器时通过抵靠设置在连接器的插入孔中的一对挡板接收销来打开闸门， 以及适于引导引导突起的一对引导槽，所述引导槽形成在所述p的表面的前部的两侧 所述引导槽沿着所述封装的插入方向从所述封装的前侧延伸。

公开(公告)号：US4868713A

公开(公告)日：1989-09-19

申请号：US175277

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00

CPC分类号： G06K19/077 ,  G11C5/00

摘要： A memory card comprises a plastic outer package which houses a semiconductor device and electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. The connecting surface of one package section of each pair of adjoining package sections has a projecting engaging portion formed thereon, and the connecting surface of the other package section of the pair of adjoining package sections has a recessed engaging portion formed therein which engages with the projecting engaging portion of the adjoining package section.

摘要翻译： 存储卡包括容纳半导体器件和电连接器的塑料外包装。 外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。 每对相邻包装部分的一个包装部分的连接表面具有形成在其上的突出接合部分，并且一对相邻包装部分中的另一个包装部分的连接表面具有形成在其中的凹入的接合部分， 相邻的包装部分的接合部分。

公开(公告)号：US4864116A

公开(公告)日：1989-09-05

申请号：US166362

申请日：1988-03-10

申请人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： G06K7/00 ,  G06K7/015 ,  G06K7/06 ,  G06K19/07 ,  H01R13/64 ,  H01R13/642

CPC分类号： G06K7/0047 ,  H01R12/721 ,  H01R12/7005 ,  H01R13/64 ,  H01R2107/00 ,  H01R24/62

摘要： A mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on a package of the IC card incorporating a semiconductor device and used to connect the semiconductor device to the external device; at least one engagement recess and/or engagement projection formed on the package of the IC card; and a connector provided in the external device. This connector is provided with an insertion hole, a plurality of electrode-contacting pieces disposed in the insertion hole and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the connector, and at least one engagement projection and/or engagement recess formed inside the insertion hole and capable of engaging the engagement recess and/or engagement projection formed on the package to enable a particular type of the IC card to be inserted into the connector.

摘要翻译： 一种用于将IC卡和外部设备彼此连接的机构，具有：多个电极端子，形成在包含半导体器件的IC卡的封装上，用于将半导体器件连接到外部设备; 形成在所述IC卡的封装上的至少一个接合凹部和/或接合突起; 以及设置在外部设备中的连接器。 该连接器设置有插入孔，多个电极接触片设置在插入孔中，并且当IC卡插入到连接器中时能够接触IC卡的多个电极端子，并且至少一个接合突起 和/或接合凹槽，其形成在插入孔内部并且能够接合形成在包装上的接合凹部和/或接合突起，以使特定类型的IC卡能够插入到连接器中。

公开(公告)号：US5173841A

公开(公告)日：1992-12-22

申请号：US674167

申请日：1991-03-25

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  B42D15/00 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14

CPC分类号： H05K7/1417 ,  H05K5/0256 ,  Y10S439/946

摘要： A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

摘要翻译： 半导体器件卡和制造该卡的方法。 框架包括一个整体间隔件，其填充电路板上的死空间，以消除将电路板上的死空间中的单独间隔件定位并且用隔离片等固定隔离件的需要。 在将用于填充电路板上的死空间的间隔物接合到相应面板的半导体器件卡中，在与正面或反面板接合的间隔物的表面上形成凹部，以减少在面板表面中发生的起伏 。

公开(公告)号：US5053613A

公开(公告)日：1991-10-01

申请号：US529434

申请日：1990-05-29

申请人： Shigeo Onoda

发明人： Shigeo Onoda

IPC分类号： G06K19/077

CPC分类号： G06K19/07735 ,  G06K19/077

摘要： An IC card has a card body with a plurality of slits extending through the thickness card body and a pair of metallic panels secured to the card body. The metallic panels have engaging portions which extend into the slits when the metallic panels are secured to the card body so that the engaging portions of both panels engage each other within respective slits to fasten both metallic panels to the card body. The electrical potentials of both metallic panels are equalized through these engaging portions.

摘要翻译： IC卡具有一个具有延伸穿过厚度卡片主体的多个狭缝的卡体和一对固定在卡体上的金属板。 当金属板固定到卡体上时，金属板具有延伸到狭缝中的接合部分，使得两个板的接合部分在相应的狭缝内彼此接合以将两个金属板紧固到卡体。 两个金属板的电位通过这些接合部分均衡。

公开(公告)号：US5047894A

公开(公告)日：1991-09-10

申请号：US514933

申请日：1990-04-26

申请人： Shigeo Onoda ,  Hajime Maeda

发明人： Shigeo Onoda ,  Hajime Maeda

IPC分类号： G06K19/077

CPC分类号： G06K19/07743

摘要： An IC card having a shutter, in which the right and left sides of the shutter are bent to form L-shaped flanges enclosing the sides of an electrode terminal board, the shutter sliding over the electrode terminal board.

公开(公告)号：US4924077A

公开(公告)日：1990-05-08

申请号：US154319

申请日：1988-02-10

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： G06K19/07 ,  B42D15/10 ,  G06K19/077 ,  G11C5/00

CPC分类号： G06K19/07743

摘要： A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for external electrical connection of the semiconductor module in the package to an external circuit; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; and an insulating layer formed on a surface of the shutter which faces the electrodes.

摘要翻译： 一种存储卡，具有：卡状包装; 设置在所述封装内的半导体模块; 安装在所述封装上的多个电极端子，用于将所述封装中的半导体模块外部电连接到外部电路; 金属快门，其设置在所述封装上，并且在所述电极端子暴露于所述电连接的打开位置和所述电极端子被覆盖的关闭位置之间可移动; 以及形成在快门面向电极的表面上的绝缘层。

公开(公告)号：US4838804A

公开(公告)日：1989-06-13

申请号：US173149

申请日：1988-03-25

申请人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Tetsuya Ueda ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： G06K7/00 ,  H01R12/50 ,  H01R13/62 ,  H01R13/71

CPC分类号： G06K7/0047 ,  H01R12/722 ,  H01R23/70 ,  H01R13/71 ,  Y10S439/955

摘要： A connection mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on the IC card package in which a semiconductor device is incorporated, the electrode terminals being adapted to connect the semiconductor device to the external device; a pair of engagement recesses formed on the package of the IC card; and a connector provided in the external device, the connector having a card receiving portion into which the IC card is inserted, a plurality of electrode-contacting pieces disposed inside the card receiving portion and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the card receiving portion to a predetermined position, and a pair of retaining members disposed on the card receiving portion and capable of advancing toward or retreating from the engagement recesses of the IC card and resiliently engaging the engagement recesses so as to retain the IC card at the predetermined position when the IC card is inserted to the predetermined position.