摘要:
A blade tensioner of a blade tensioner system for a chain that drivingly connects a drive shaft to a driving shaft in an engine, that improves the chain-damping efficiency in a blade tensioner applied to the chain within an engine, prevents the sideways tilt of the blade tensioner during operation, in a blade tensioner applied to the chain in an engine, and provides a blade tensioner with a functionality that allows it to transversely guide a chain along the chain sliding face in a blade shoe, while maintaining the flexural deformability (i.e., the flexibility) of the blade shoe.
摘要:
A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
摘要:
An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.
摘要:
A connector-supporting element of a main frame of an IC card and a sub-frame receive holding parts of a connector. The connector-supporting element has barriers having a height of at least one-half that of the holding parts for receiving the barriers and a force applied in the direction along bonded surfaces of the connector-supporting element and the sub-frame. Oblique surfaces are respectively provided on each of the barriers and there is a positional deviation in the parts.
摘要:
A voltage-control type semiconductor switching device is disclosed which includes a pair of controlled electrodes to which a control voltage signal is supplied, and a semiconductive layer formed between the electrodes so as electrically insulative from the electrodes through insulative layers. The semiconductive layer has a channel region and a carrier-storage region which is substantially nonconductive. The channel region is formed laterally along the longitudinal direction of the electrodes, thereby allowing majority carriers such as electrons of the semiconductive layer to flow in the lateral direction. In the current cut-off mode, the carrier-storage region temporarily stores the carriers which move in the direction of thickness of the semiconductive layer due to the electric field created by the voltage. In the current conduction mode, the carrier-storage region releases the carriers stored therein toward the channel region.
摘要:
A rotary kiln comprises a rotary drum having a large number of lifters along its inner wall. The end portion of each lifter which is extended interiorly of the rotary drum is bent in the rotational direction of the rotary drum. To the end of each lifter are attached a number of chain like fittings which makes sliding movements along the inner wall surface of the rotary drum and along the upper and lower faces of each lifter in accordance with the rotation of the rotary drum. The chain like fittings so act as to prevent a substance to be dried from adhering to the inner wall of the rotary drum and to the lifters through making sliding movements in accordance with the drum rotation. Further, since the chain like fittings act to break the substance into small pieces and to release it upon dropping due to their own weights, it is dried effectively.
摘要:
A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.
摘要:
In a portable electrical device, a plurality of engaging portions of a frame on surfaces of the frame are directed in the same direction and engaging portions on two connecting terminals can be brought into engagement with the engaging portions along the same direction. Thus, both of the connecting terminals can be mounted on the frame from the same direction, and the efficiency of the mounting operation is improved and can be automated. Furthermore, deformation of or damage to the connecting terminals, caused by the mounting process, is reduced.
摘要:
A conveyor apparatus comprising a rail device and automotive carts supported and guided by the rail device to be travelled. The rail device comprises an automotive cart guiding member having a C letter-shaped section provided with an opened portion for travelling the cart therethrough and a duct member communicating with the guiding member through a slit. The cleaning of the inside of the duct member, the installation of various kinds of instrument and the wiring operation within the duct member, the maintenance and inspection after the wiring operation and the like can be carried out through the opened portion and the slit.
摘要:
A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.