Invention Grant
- Patent Title: Method of and apparatus for forming a micromelt structure on an electrically-conductive probe tip
- Patent Title (中): 在导电探头上形成微结构的方法与装置
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Application No.: US665769Application Date: 1991-03-07
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Publication No.: US5178742APublication Date: 1993-01-12
- Inventor: Heiko Lemke , Thomas Goddenhenrich , Hans-Peter Bochem , Uwe Hartmann
- Applicant: Heiko Lemke , Thomas Goddenhenrich , Hans-Peter Bochem , Uwe Hartmann
- Applicant Address: DEX Julich
- Assignee: Forschungszentrum Julich GmbH
- Current Assignee: Forschungszentrum Julich GmbH
- Current Assignee Address: DEX Julich
- Priority: DEX4007292 19900308
- Main IPC: C25D1/00
- IPC: C25D1/00 ; B23H9/18 ; C23C26/02 ; G01B7/34 ; G01N27/30 ; G01N37/00 ; G01Q70/16 ; H01J37/22 ; H01J37/28
Abstract:
A micromelt structure is provided on a probe tip by contacting the probe tip with a foil of the material from which the micromelt structure is to be formed and passing an electric current through the contact point to melt the foil and cause the molten foil material to collect on the tip of the probe where, by surface tension, it is drawn into a microsphere shape and homogeneously solidifies. The probe with the micromelt tip is highly reproducible and uniform and is particularly effective for use as a probe in scanning microscopy.
Public/Granted literature
- US5782488A Stress reducer passenger cushion Public/Granted day:1998-07-21
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