Invention Grant
- Patent Title: Propenyl group-containing epoxy resin
- Patent Title (中): 含丙烯基的环氧树脂
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Application No.: US649027Application Date: 1991-02-01
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Publication No.: US5179176APublication Date: 1993-01-12
- Inventor: Toshio Shiobara , Hisashi Shimizu , Takayuki Aoki
- Applicant: Toshio Shiobara , Hisashi Shimizu , Takayuki Aoki
- Applicant Address: JPX Tokyo
- Assignee: Shin-Etsu Chemical Company, Ltd.
- Current Assignee: Shin-Etsu Chemical Company, Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX2-23837 19900202
- Main IPC: C07D303/27
- IPC: C07D303/27 ; C08G8/12 ; C08G59/08 ; C08G59/32 ; C08L63/00 ; C08L79/08
Abstract:
An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.
Public/Granted literature
- US5842884A Male connector Public/Granted day:1998-12-01
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