发明授权
US5188280A Method of bonding metals, and method and apparatus for producing
semiconductor integrated circuit device using said method of bonding
metals
失效
接合金属的方法以及使用所述金属接合方法制造半导体集成电路器件的方法和装置
- 专利标题： Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
- 专利标题（中）： 接合金属的方法以及使用所述金属接合方法制造半导体集成电路器件的方法和装置
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申请号： US812024申请日： 1991-12-23
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公开(公告)号： US5188280A公开(公告)日： 1993-02-23
- 发明人: Takashi Nakao , Yoshiaki Emoto , Koichiro Sekiguchi , Masayuki Iketani , Kunizo Sahara , Ikuo Yoshida , Akiomi Kohno , Masaya Horino , Hideaki Kamohara , Shouichi Irie , Hiroshi Akasaki , Kanji Otsuka
- 申请人： Takashi Nakao , Yoshiaki Emoto , Koichiro Sekiguchi , Masayuki Iketani , Kunizo Sahara , Ikuo Yoshida , Akiomi Kohno , Masaya Horino , Hideaki Kamohara , Shouichi Irie , Hiroshi Akasaki , Kanji Otsuka
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi Ltd.,Hitachi VLSI Engineering Corp.
- 当前专利权人： Hitachi Ltd.,Hitachi VLSI Engineering Corp.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX1-107649 19890428; JPX1-123353 19890517; JPX1-309922 19891129
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/60 ; H01L23/055 ; H01L23/498 ; H05K3/34
摘要：
A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.
公开/授权文献
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