发明授权
- 专利标题： Heat sink/circuit board assembly
- 专利标题（中）： 散热片/电路板组装
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申请号： US794149申请日： 1991-11-21
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公开(公告)号： US5191512A公开(公告)日： 1993-03-02
- 发明人: Shinichi Ogura , Hiroo Adachi , Osamu Shishido , Tetsuya Watanabe , Yuuichi Mineo , Tohru Kageyama , Yoichi Nishiyama , Takashi Yamaguchi , Keiichi Ogawa
- 申请人： Shinichi Ogura , Hiroo Adachi , Osamu Shishido , Tetsuya Watanabe , Yuuichi Mineo , Tohru Kageyama , Yoichi Nishiyama , Takashi Yamaguchi , Keiichi Ogawa
- 申请人地址： JPX Tokyo
- 专利权人： Pioneer Electronic Corporation
- 当前专利权人： Pioneer Electronic Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-25987[U] 19910417
- 主分类号： H01L23/40
- IPC分类号： H01L23/40 ; H05K7/20
摘要：
A heat sink/circuit board assembly allows repairing or inspection of circuit or parts without impairing heat-radiating effect. A sub-heat sink is protruded from a lateral end of the circuit board in a direction parallel to the main surface of the circuit board and is connected to the main heat sink at its protruding portion. The diameter of the opening of the recessed portion of the main heat sink facing the circuit board is made larger than outer diameter of the circuit board. When circuit elements on the main surface of the circuit board facing the recessed portion of the main heat sink are to be repaired or inspected, the main heat sink is connected to the sub-heat sink on a main surface which is on the opposite side to the surface carrying the circuit elements, while the same heat-radiating effect as in the normal condition can be obtained.
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