公开(公告)号：US5365195A

公开(公告)日：1994-11-15

申请号：US60054

申请日：1993-05-13

申请人： Tohru Kageyama

发明人： Tohru Kageyama

IPC分类号： H01C13/00 ,  H03G1/00 ,  H03G3/00 ,  H03K17/00 ,  H03G3/30

CPC分类号： H03G1/0088 ,  H03G3/001

摘要： This invention provides a volume apparatus, which is formed of semiconductor resistors and semiconductor switches and which reduces distortion and noise in attenuation signals. The volume apparatus, which comprises: a first semiconductor voltage dividing circuit successively attenuating an input signal and outputting attenuated signals; a first semiconductor switch circuit controlling the supply of the attenuated signals output from the first semiconductor voltage dividing circuit; a phase inversion circuit for inverting the phase of the input signal; a second semiconductor voltage dividing circuit successively attenuating the input signal output from the phase inversion circuit and outputting attenuated signals; a second semiconductor switch circuit controlling the supply of the attenuated signals output from the second semiconductor voltage dividing circuit; a volume control circuit controlling the first and second semiconductor switch circuits according to a control signal; and a differential amplifier having one of input terminals thereof connected to the output of the first semiconductor switch circuit and the other connected to the output of the second semiconductor switch circuit.

摘要翻译： 本发明提供一种由半导体电阻器和半导体开关形成的体积装置，其减少衰减信号中的失真和噪声。 该音量装置包括：连续衰减输入信号并输出​​衰减信号的第一半导体分压电路; 控制从第一半导体分压电路输出的衰减信号的供给的第一半导体开关电路; 相位反转电路，用于反相输入信号的相位; 第二半导体分压电路，连续地衰减从相位反转电路输出的输入信号并输出​​衰减的信号; 控制从第二半导体分压电路输出的衰减信号的供给的第二半导体开关电路; 音量控制电路根据控制信号控制第一和第二半导体开关电路; 以及差分放大器，其一个输入端连接到第一半导体开关电路的输出，另一个连接到第二半导体开关电路的输出端。

公开(公告)号：US5191512A

公开(公告)日：1993-03-02

申请号：US794149

申请日：1991-11-21

申请人： Shinichi Ogura ,  Hiroo Adachi ,  Osamu Shishido ,  Tetsuya Watanabe ,  Yuuichi Mineo ,  Tohru Kageyama ,  Yoichi Nishiyama ,  Takashi Yamaguchi ,  Keiichi Ogawa

发明人： Shinichi Ogura ,  Hiroo Adachi ,  Osamu Shishido ,  Tetsuya Watanabe ,  Yuuichi Mineo ,  Tohru Kageyama ,  Yoichi Nishiyama ,  Takashi Yamaguchi ,  Keiichi Ogawa

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2924/0002

摘要： A heat sink/circuit board assembly allows repairing or inspection of circuit or parts without impairing heat-radiating effect. A sub-heat sink is protruded from a lateral end of the circuit board in a direction parallel to the main surface of the circuit board and is connected to the main heat sink at its protruding portion. The diameter of the opening of the recessed portion of the main heat sink facing the circuit board is made larger than outer diameter of the circuit board. When circuit elements on the main surface of the circuit board facing the recessed portion of the main heat sink are to be repaired or inspected, the main heat sink is connected to the sub-heat sink on a main surface which is on the opposite side to the surface carrying the circuit elements, while the same heat-radiating effect as in the normal condition can be obtained.

摘要翻译： 散热器/电路板组件允许修复或检查电路或部件，而不会损害散热效果。 亚散热器从电路板的横向端部沿着与电路板的主表面平行的方向突出，并且在其突出部分处连接到主散热器。 面向电路板的主散热片的凹部的开口直径比电路板的外径大。 当电路板主表面上面对主散热片凹陷部分的电路元件进行修理或检查时，主散热器与主散热片相连， 表面承载电路元件，同时可获得与正常条件相同的散热效果。