Invention Grant
US5200362A Method of attaching conductive traces to an encapsulated semiconductor
die using a removable transfer film
失效
使用可移除转移膜将导电迹线附着到封装的半导体管芯的方法
- Patent Title: Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
- Patent Title (中): 使用可移除转移膜将导电迹线附着到封装的半导体管芯的方法
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Application No.: US756952Application Date: 1991-09-09
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Publication No.: US5200362APublication Date: 1993-04-06
- Inventor: Paul T. Lin , Michael B. McShane , Sugio Uchida , Takehi Sato
- Applicant: Paul T. Lin , Michael B. McShane , Sugio Uchida , Takehi Sato
- Applicant Address: IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: IL Schaumburg
- Priority: JPX1-231323 19890906
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/68 ; H01L23/498 ; H05K3/34
Abstract:
A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one side of the conductive traces, and the interconnecting means. The film of transfer material forms, at this stage of the process, one side of the package. The film of transfer material is then peeled from the pattern of conductive traces and the resin body to expose the other side of the pattern of conductive traces. Contact to the other side of the pattern provides electrical contact to the senmiconductor device die.
Public/Granted literature
- US4645316A Rear view mirror assembly Public/Granted day:1987-02-24
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