发明授权
- 专利标题： Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
- 专利标题（中）： 具有抑制热扩散的方法的复合电路板及其制造方法
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申请号： US615337申请日： 1990-11-19
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公开(公告)号： US5223676A公开(公告)日： 1993-06-29
- 发明人: Masaaki Yamamoto , Hiroshi Yatabe , Kenzo Kobayashi , Hajime Mochizuki
- 申请人： Masaaki Yamamoto , Hiroshi Yatabe , Kenzo Kobayashi , Hajime Mochizuki
- 申请人地址： JPX Tokyo
- 专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX1-136110[U] 19891127; JPX2-80679 19900330; JPX2-98132[U] 19900920
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/538 ; H05K1/00 ; H05K1/02 ; H05K3/20 ; H05K3/42 ; H05K3/46
摘要：
The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a given portion for connecting components to the thick circuit conductor and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of the substrate, which includes a land corresponding to the parts-mounting section of the thick circuit conductor and has a predetermined circuit pattern, and a conductor for electrically connecting the land and the given portion of the thick circuit conductor. In this circuit board, the land and the given portion of the thick circuit conductor are connected by a conducting member provided in the through hole.
公开/授权文献
- US4539310A Steam reforming catalyst 公开/授权日：1985-09-03
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