发明授权
- 专利标题： Epoxy resin compositions and cured products thereof
- 专利标题（中）： 环氧树脂组合物及其固化产品
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申请号： US798750申请日： 1991-11-27
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公开(公告)号： US5225484A公开(公告)日： 1993-07-06
- 发明人: Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Takashi Tsuchiya
- 申请人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Takashi Tsuchiya
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd
- 当前专利权人： Shin-Etsu Chemical Co., Ltd
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-339911 19901130
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08G59/00 ; C08G59/02 ; C08G59/14 ; C08G59/18 ; C08G59/32 ; C08G59/40 ; C08K5/5425 ; C08L63/00 ; C08L101/00 ; H01L23/29 ; H01L23/31
摘要：
A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.