发明授权
US5238876A Method of dividing semiconductor wafer using ultraviolet sensitive tape
失效
使用紫外线敏感胶带分割半导体晶片的方法
- 专利标题： Method of dividing semiconductor wafer using ultraviolet sensitive tape
- 专利标题（中）： 使用紫外线敏感胶带分割半导体晶片的方法
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申请号： US554436申请日： 1990-07-19
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公开(公告)号： US5238876A公开(公告)日： 1993-08-24
- 发明人: Toshio Takeuchi , Ichiro Hayashi , Shuichi Osaka
- 申请人： Toshio Takeuchi , Ichiro Hayashi , Shuichi Osaka
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX1-187430 19890721
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B28D5/00 ; H01L21/301 ; H01L21/304 ; H01L21/68
摘要：
A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.
公开/授权文献
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