Aromatic polyamide oligomers containing polymerizable unsaturated groups are prepared by heating and reacting together an aromatic diisocyanate, an aromatic dicarboxylic acid and an unsaturated compound capable of reacting with the aromatic diisocyanate. The aromatic polyamide oligomers thus obtained have excellent molding processability and are useful as raw materials for thermosetting polyamides with enhanced mechanical strength and chemical stability at higher temperatures. The compositions comprising the aromatic polyamide oligomers and maleimide derivatives, further produce cured molded bodies with excellent heat resistance.