Invention Grant
- Patent Title: Wafer bonding process employing liquid oxidant
- Patent Title (中): 使用液体氧化剂的晶圆焊接工艺
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Application No.: US834439Application Date: 1992-02-12
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Publication No.: US5266135APublication Date: 1993-11-30
- Inventor: John P. Short , Craig J. McLachlan , George V. Rouse , James R. Zibrida
- Applicant: John P. Short , Craig J. McLachlan , George V. Rouse , James R. Zibrida
- Applicant Address: FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: FL Melbourne
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/316 ; H01L21/762 ; B32B31/24
Abstract:
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.
Public/Granted literature
- US6089336A Rotary drill bits Public/Granted day:2000-07-18
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