公开(公告)号：US5266135A

公开(公告)日：1993-11-30

申请号：US834439

申请日：1992-02-12

Applicant: John P. Short ,  Craig J. McLachlan ,  George V. Rouse ,  James R. Zibrida

Inventor： John P. Short ,  Craig J. McLachlan ,  George V. Rouse ,  James R. Zibrida

IPC: H01L21/20 ,  H01L21/316 ,  H01L21/762 ,  B32B31/24

CPC classification number: H01L21/76297 ,  H01L21/2007 ,  H01L21/31654 ,  H01L21/76251 ,  H01L21/76275 ,  Y10S148/135

Abstract: A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.

Abstract translation: 一种粘合方法，包括将一对切片与液体氧化剂一起压在其间并使所述一对切片温度将切片粘合在一起。 优选地，在将它们压在一起然后干燥之前将液体氧化剂施加到其中一个切片。 用于接合的加热步骤在至少1100℃的足够高的温度下进行，以使切片在粘合步骤期间柔顺以便彼此相符。

公开(公告)号：US08172992B2

公开(公告)日：2012-05-08

申请号：US12633219

申请日：2009-12-08

Applicant: Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

Inventor： Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

IPC: C25B9/02

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract translation: 提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。 在电镀工艺之后从设备中取出半导体晶片时可能发生污染。 在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。 此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。 在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。

公开(公告)号：US5334273A

公开(公告)日：1994-08-02

申请号：US137293

申请日：1993-10-14

Applicant: John P. Short ,  Craig J. McLachlan ,  George V. Rouse ,  James R. Zibrida

Inventor： John P. Short ,  Craig J. McLachlan ,  George V. Rouse ,  James R. Zibrida

IPC: H01L21/20 ,  H01L21/316 ,  H01L21/762 ,  B32B31/24

CPC classification number: H01L21/76297 ,  H01L21/2007 ,  H01L21/31654 ,  H01L21/76251 ,  H01L21/76275 ,  Y10S148/135

Abstract: A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.

Abstract translation: 一种粘合方法，包括将一对切片与液体氧化剂一起压在其间并使所述一对切片温度将切片粘合在一起。 优选地，在将它们压在一起然后干燥之前将液体氧化剂施加到其中一个切片。 用于接合的加热步骤在至少1100℃的足够高的温度下进行，以使切片在粘合步骤期间柔顺以便彼此相符。

公开(公告)号：US20120181170A1

公开(公告)日：2012-07-19

申请号：US13432767

申请日：2012-03-28

Applicant: Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

Inventor： Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

IPC: C25D17/08

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract translation: 提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。 在电镀工艺之后从设备中取出半导体晶片时可能发生污染。 在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。 此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。 在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。

公开(公告)号：US20100155254A1

公开(公告)日：2010-06-24

申请号：US12633219

申请日：2009-12-08

Applicant: Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

Inventor： Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

IPC: C25D7/12 ,  C25D17/00 ,  C25D17/02

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract translation: 提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。 在电镀工艺之后从设备中取出半导体晶片时可能发生污染。 在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。 此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。 在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。