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US5267118A Method and apparatus for thermally separating devices on a power integrated circuit 失效
用于在功率集成电路上热分离器件的方法和装置

Method and apparatus for thermally separating devices on a power integrated circuit
摘要：
Circuitry (46, or 28 and 70) for thermally separating a power integrated circuit device (12) from a plurality of other such devices (14, 16, and 18) on a common power integrated circuit chip (10) operate when the device (12) reaches a thermal shutdown temperature setpoint (56) with an output current at a predetermined current limit (54). The circuitry 46, or 28 and 70 switches the output current to a shutdown current level (57) until the device (12) reaches a predetermined lower temperature setpoint (58). Circuitry (46, or 28 and 70) restores the output current level to the predetermined current limit only after the device (12) reaches both the predetermined lower temperature setpoint (58) and a predetermined circuit setpoint (62 or 74). The circuit setpoint (62 or 74) associates with the temperature of the device (12) and may be either a yet lower temperature setpoint (62) or a specified time delay (74). The above steps are repeated to lower the average temperature of the device (12) and thereby thermally separate the device (12) from the other of such devices (14, 16 and 18) on the common power integrated circuit chip (10).
摘要（中）：

用于将功率集成电路器件（12）与公共功率集成电路芯片（10）上的多个其它这样的器件（14,16和18）热分离的电路（46或28和70）在器件 12）以预定电流极限（54）的输出电流达到热关断温度设定点（56）。 电路46或28和70将输出电流切换到关断电流电平（57），直到装置（12）达到预定的较低温度设定点（58）。 只有在设备（12）达到预定的较低温度设定点（58）和预定的电路设定点（62或74）之后，电路（46或28和70）才将输出电流电平恢复到预定电流限制。 电路设定点（62或74）与设备（12）的温度相关联，并且可以是较低温度设定点（62）或指定的时间延迟（74）。 重复上述步骤以降低装置（12）的平均温度，从而将装置（12）与公共功率集成电路芯片（10）上的另一个装置（14,16和18）热分离。

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