When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated without dividing the chip or the wafer, so that the separated specimen can be moved to a desired position, and the separated specimen can be set to a desired attitude. Therefore, various analyses on the specimen through TEM, SEM, SIMS and so on can be carried out. A minute piece of specimen is cut and separated from the substrate of a specimen by use of a three-dimensional minute processing technique and a micro-manipulation technique. A surface of the specimen is subjected to an FIB processing from at least two kinds of angles, the separated specimen being mechanically connected to an external probe in a step for separating a part of the specimen including a portion to be analyzed. The separated specimen is supported by the probe, being moved. The separated specimen is subjected to analysis through TEM, SEM, SIMS, etc.