发明授权
- 专利标题: Apparatus for inspecting wiring pattern formed on a board
- 专利标题(中): 用于检查在板上形成的布线图案的装置
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申请号: US936324申请日: 1992-08-28
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公开(公告)号: US5272763A公开(公告)日: 1993-12-21
- 发明人: Yuji Maruyama , Atsuharu Yamamoto , Hidemi Takahashi , Hidehiko Kawakami
- 申请人: Yuji Maruyama , Atsuharu Yamamoto , Hidemi Takahashi , Hidehiko Kawakami
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX2-52128 19900302; JPX2-52130 19900302; JPX2-173448 19900629; JPX2-189083 19900716; JPX2-334009 19901129
- 主分类号: G01R31/28
- IPC分类号: G01R31/28 ; G01R31/309 ; G06T7/60 ; G06K9/00
摘要:
An inspection apparatus for inspecting a wiring pattern on a printed board by illuminating the printed board with light to photoelectrically convert light reflected from the printed board into an optical grey level image corresponding to the wiring pattern thereon, the grey level image being converted into a bi-level image. The inspection apparatus includes a thinning circuit to perform a thinning process for removing the bi-level image by one picture element from the background side of the wiring pattern, the thinning process being repeatedly performed predetermined times with respect to all of picture elements of the wiring pattern to output the number of repetitions of the thinning process and further to output a skeleton image. Also included is a distance image converter to output a distance conversion image where the number of repetitions is given as a distance value from the background of the wiring pattern. The inspection apparatus compares the distance value of the distance conversion image with one or more thresholds along the skeleton image. This arrangement allows direct detection of the wiring pattern width, thereby permitting the wiring pattern inspection with a simple structure.
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