发明授权
US5275184A Apparatus and system for treating surface of a wafer by dipping the same
in a treatment solution and a gate device for chemical agent used in
the apparatus and the system
失效
将其浸渍在处理溶液中的用于处理晶片表面的装置和系统以及用于装置和系统中的化学试剂的浇口装置
- 专利标题： Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
- 专利标题（中）： 将其浸渍在处理溶液中的用于处理晶片表面的装置和系统以及用于装置和系统中的化学试剂的浇口装置
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申请号： US779481申请日： 1991-10-18
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公开(公告)号： US5275184A公开(公告)日： 1994-01-04
- 发明人: Hisao Nishizawa , Yoshio Nomura , Hiroyuki Araki
- 申请人： Hisao Nishizawa , Yoshio Nomura , Hiroyuki Araki
- 申请人地址： JPX Kyoto
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人地址： JPX Kyoto
- 优先权： JPX2-109823[U] 19901019
- 主分类号： B08B3/10
- IPC分类号： B08B3/10 ; H01L21/00
摘要：
A dipping type wafer treatment apparatus includes a treatment solution bath capable of forming a uniform rising flow of a treatment solution inside from an inlet to an outlet, a treatment solution supplying unit for supplying a treatment solution at a constant velocity to the inlet of the treatment solution bath to form a uniform rising flow of the treatment solution inside the treatment solution bath and a device for dipping and retrieving the wafer into and out of the uniform flow of the treatment solution. The treatment solution is supplied from the inlet in the treatment solution bath and drown off through an outlet of the treatment solution bath. Accordingly, the treatment solution can be rapidly substituted, and the wafers to no experience contact with air during replacement of the treatment solutions.
公开/授权文献
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