摘要:
A dipping type wafer treatment apparatus includes a treatment solution bath capable of forming a uniform rising flow of a treatment solution inside from an inlet to an outlet, a treatment solution supplying unit for supplying a treatment solution at a constant velocity to the inlet of the treatment solution bath to form a uniform rising flow of the treatment solution inside the treatment solution bath and a device for dipping and retrieving the wafer into and out of the uniform flow of the treatment solution. The treatment solution is supplied from the inlet in the treatment solution bath and drown off through an outlet of the treatment solution bath. Accordingly, the treatment solution can be rapidly substituted, and the wafers to no experience contact with air during replacement of the treatment solutions.
摘要:
A substrate processing apparatus has a cup part for receiving processing liquid which is applied from a processing liquid applying part and is splashed from a substrate, and the cup part is formed of electrical insulation material. Hydrophilic treatment is performed on an outer annular surface of the cup part and water is held on the outer annular surface of the cup part while processing the substrate. With this structure, charged potential of the cup part generated in splashing of pure water can be suppressed by the water held on the outer annular surface, without greatly increasing the manufacturing cost of the substrate processing apparatus by forming the cup part with special conductive material. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.
摘要:
A history information obtaining unit obtains information about a use history of an endoscope. An estimating unit makes an estimation of a secular change in the endoscope from its use start until the present time based on this information. A displaying unit displays a ratio of a result of the estimation made by the estimating unit to the degree of the secular change, which is preset for the endoscope.
摘要:
Holes having a variety of shapes exist on a surface of a substrate. When pure water is supplied on the substrate in a rinsing process, part of the pure water enters the holes. The pure water which have entered the holes can be hardly shaken off even though the substrate is rotated at a high speed. Therefore, HFE is held on the substrate so as to form an HFE layer after the rinsing process. In this case, the HFE enters the holes while the pure water emerges from the holes to the upper surface of the HFE due to a difference in specific gravity between the pure water and the HFE. Thus, the pure water is reliably prevented from remaining in the holes.
摘要:
A deionized water temperature control part cools deionized water which is supplied from a deionized water supply source into a processing bath through a pipe after completely cleaning a substrate in the processing bath for maintaining the deionized water at a constant temperature which is lower than the ordinary temperature. A supply port of an IPA.N2 supply part provided in a casing of a multi-functional processing part is directed upward, thereby supplying IPA vapor upward with carrier gas of N2 for forming an atmosphere containing IPA vapor in high concentration above the processing bath. Thus, the substrate cooled to a low temperature is dried in the atmosphere containing the IPA vapor of the ordinary temperature in the upper portion of the processing bath when pulled up from the processing bath. Thus, the amount of the IPA vapor dissolved in the deionized water stored in the processing bath may be small, whereby consumption of the IPA vapor as well as generation of particles can be suppressed.
摘要:
A control unit controls a lifter to raise at least part of each of a group of substrates above the liquid level of a treating liquid in a treating bath. Thereafter, a valve is opened to drain the treating liquid from the treating bath at a high speed. As a result, a physical force to tilt and adhere an upper portion of the adjacent substrates accompanied by lowering of the liquid level of the treating liquid due to the high speed drainage acts upon a lower portion of the substrates near the lowered liquid level of the treating liquid, thereby reducing the physical force exerted on the substrates. This arrangement, even if a holding interval between the substrates is narrowed at a half of a normal pitch, eliminates a contact of the adjacent substrates and prevents damage of the substrates due to the contact without providing an additional member such as a substrate support guide in the treating bath.
摘要:
In the embodiment of the present invention, when identification information acquired from a drug or instrument to be used on a patient is not included in schedule information stored beforehand, a user is notified to confirm that the identification information is not included in the schedule information. After the notification is provided, in registering the acquired identification information as practice details, the name of a doctor who instructed to use the drug or instrument, which is different from the drug or instrument specified by schedule information, and the reason for the instruction are registered, while associated with the practice details. Accordingly, drugs or instruments necessary for patients can be used in an appropriate manner.
摘要:
A substrate processing apparatus includes a photosensor for detecting the presence/absence of a substrate in each place within a carrier cassette, a pair of processing tanks for performing the same process at the same time, and a supply mechanism for supplying a processing solution to the processing tanks independently. The number of substrates is detected in accordance with the result of the detection of the photosensor. If the number of substrates detected is not greater than an allowable number for one of the processing tanks, the processing solution is supplied to only the one processing tank to perform the process. This reduces the consumption of the processing solution in a batch process.
摘要:
The substrate treatment method includes a deionized water supply step of supplying deionized water on a surface of a substrate; a resistivity reducing gas supply step of supplying a resistivity reducing gas so as to change ambient air to which the deionized water in contact with the surface of the substrate is exposed, into an ambient of the resistivity reducing gas capable of reducing the resistivity of deionized water; and a deionized water removal step of removing the deionized water from the surface of the substrate after the resistivity reducing gas supply step.