发明授权
- 专利标题： Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps
- 专利标题（中）： 当执行利用高应力金属和/或多个蒸发步骤的剥离过程时，减轻应力和抵抗模板分层的方法和装置
-
申请号： US778496申请日： 1991-10-17
-
公开(公告)号： US5277749A公开(公告)日： 1994-01-11
- 发明人: Jonathan H. Griffith , John I. Kim , Thomas L. Leong , William J. Tilly , Sari Wacks
- 申请人： Jonathan H. Griffith , John I. Kim , Thomas L. Leong , William J. Tilly , Sari Wacks
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： G03F7/09
- IPC分类号： G03F7/09 ; H01L21/027 ; H01L21/768 ; C23C14/00
摘要：
A layer of photoresist provides a stress relief (or cushion) layer between a lift-off polymer layer and a barrier of multi-level lift-off structures. When multiple evaporation steps are required using the same lift-off pattern, the adhesion between organosilicon and organic film is stressed by a first blanked metal film. To prevent delamination between the lift-off polymer layer and RIE barrier photoresist is applied on top of the lift-off polymer and sandwiched between the organosilicon and organic materials. This photoresist acts as a cushion and as an adhesion promoter to reduce delamination after the metal deposition(s).
公开/授权文献
- US5832841A Shipping platform apparatus 公开/授权日：1998-11-10
信息查询
IPC分类:
