发明授权
- 专利标题: Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane
- 专利标题(中): 具有接地面和电源面的多层引线框架的制造方法
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申请号: US701183申请日: 1991-05-16
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公开(公告)号: US5281556A公开(公告)日: 1994-01-25
- 发明人: Mitsuharu Shimizu , Yoshiki Takeda
- 申请人: Mitsuharu Shimizu , Yoshiki Takeda
- 申请人地址: JPX Nagano
- 专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人地址: JPX Nagano
- 优先权: JPX2-130083 19900518
- 主分类号: H01L23/50
- IPC分类号: H01L23/50 ; H01L21/48 ; H01L23/495 ; H01L21/58 ; H01L21/60
摘要:
A process for manufacturing a multi-layer semiconductor lead frame comprising the step of adhering a lead frame strip to a metal power supply plane strip and a metal ground plane strip.
公开/授权文献
- US5690222A Package retainer for surgical screw 公开/授权日:1997-11-25