发明授权
US5284554A Electrochemical micromachining tool and process for through-mask
patterning of thin metallic films supported by non-conducting or poorly
conducting surfaces
失效
电化学微加工工具和由不导电或导电不良的表面支撑的薄金属膜的通孔掩模图案化工艺
- 专利标题： Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
- 专利标题（中）： 电化学微加工工具和由不导电或导电不良的表面支撑的薄金属膜的通孔掩模图案化工艺
-
申请号： US819310申请日： 1992-01-09
-
公开(公告)号： US5284554A公开(公告)日： 1994-02-08
- 发明人: Madhav Datta , Lubomyr T. Romankiw
- 申请人： Madhav Datta , Lubomyr T. Romankiw
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C25F3/06
- IPC分类号： C25F3/06 ; C23F1/02 ; C25F3/14 ; C25F7/00 ; H01G13/00 ; H05K3/07 ; B23H3/10 ; B23H7/32 ; B23H9/06
摘要：
The present invention describes a high speed, high precision electrochemical micromachining tool, chemical solution and method for the one sided through-mask micropatterning of conducting foils and films supported by insulating material. The tool of the present invention can include either a movable plate means allowing for the movement of the workpiece to and fro above the cathode assembly, or a movable cathode assembly means allowing for the movement of said cathode assembly to and fro beneath the workpiece. Said cathode assembly also consists of a nozzle assembly from which the electrolytic solution emerges as electrolytic shower and impinges upon the workpiece. Methods to resolve the problems related to the loss of electrical contact during the electrochemical micromachining process are also described.
公开/授权文献
信息查询
